Authors: Cole, EI

Citation: Ei. Cole, Global fault localization using induced voltage alteration, MICROEL REL, 41(8), 2001, pp. 1145-1159

Authors: Tangyunyong, P Benson, D Cole, EI

Citation: P. Tangyunyong et al., Thermal modeling of a polysilicon-metal test structure used for thermally induced voltage alteration characterization, J VAC SCI B, 18(6), 2000, pp. 2820-2825

Authors: Barton, DL Bernhard-Hofer, K Cole, EI

Citation: Dl. Barton et al., FLIP-chip and "backside" techniques, MICROEL REL, 39(6-7), 1999, pp. 721-730

Authors: Cole, EI Tangyunyong, P Benson, DA Barton, DL

Citation: Ei. Cole et al., TIVA and SEI developments for enhanced front and backside interconnection failure analysis, MICROEL REL, 39(6-7), 1999, pp. 991-996

Authors: Cole, EI Tangyunyong, P Barton, DL

Citation: Ei. Cole et al., Local thermal probing to detect open and shorted IC interconnections, MICROEL REL, 39(5), 1999, pp. 681-693

Authors: Cole, EI Barton, DL

Citation: Ei. Cole et Dl. Barton, Failure site isolation: Photon emission microscopy optical/electron beam techniques, FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 1999, pp. 87-112