Citation: P. Tangyunyong et al., Thermal modeling of a polysilicon-metal test structure used for thermally induced voltage alteration characterization, J VAC SCI B, 18(6), 2000, pp. 2820-2825
Authors:
Cole, EI
Tangyunyong, P
Benson, DA
Barton, DL
Citation: Ei. Cole et al., TIVA and SEI developments for enhanced front and backside interconnection failure analysis, MICROEL REL, 39(6-7), 1999, pp. 991-996
Citation: Ei. Cole et Dl. Barton, Failure site isolation: Photon emission microscopy optical/electron beam techniques, FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 1999, pp. 87-112