Authors: Field, DP Dornisch, D Tong, HH

Citation: Dp. Field et al., Investigating the microstructure-reliability relationship in Cu damascene lines, SCR MATER, 45(9), 2001, pp. 1069-1075

Authors: Dornisch, D

Citation: D. Dornisch, Competitive dynamics in Polish telecommunications, 1990-2000: growth, regulation, and privatization of an infrastructural multi-network, TELECOMM PO, 25(6), 2001, pp. 381-407

Authors: Dornisch, D Li, GM Brongo, M

Citation: D. Dornisch et al., Cu contamination control for advanced interconnect manufacturing, SOL ST TECH, 43(5), 2000, pp. 137

Authors: Zhao, B Feiler, D Ramanathan, V Liu, QZ Brongo, M Wu, J Zhang, H Kuei, JC Young, D Brown, J Vo, C Xia, W Chu, C Zhou, J Nguyen, C Tsau, L Dornisch, D Camilletti, L Ding, P Lai, G Chin, B Krishna, N Johnson, M Turner, J Ritzdorf, T Wu, G Cook, L

Citation: B. Zhao et al., Dual Damascene interconnect of copper and low permittivity dielectric for high performance integrated circuits, EL SOLID ST, 1(6), 1998, pp. 276-278