AAAAAA
Results:
1-7
|
Results: 7
Authors:
ALSARAWI SF
ABBOTT D
FRANZON PD
Citation: Sf. Alsarawi et al., A REVIEW OF 3-D PACKAGING TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 2-14
Authors:
LIPA S
STEER MB
CANGELLARIS AC
FRANZON PD
Citation: S. Lipa et al., EXPERIMENTAL CHARACTERIZATION OF TRANSMISSION-LINES IN THIN-FILM MULTICHIP MODULES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 122-126
Authors:
FRANZON PD
STANASKI A
TEKMEN Y
BANERJIA S
Citation: Pd. Franzon et al., SYSTEM-DESIGN OPTIMIZATION FOR MCM-D FLIP-CHIP/, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(4), 1995, pp. 620-627
Authors:
BASEL MS
STEER MB
FRANZON PD
Citation: Ms. Basel et al., SIMULATION OF HIGH-SPEED INTERCONNECTS USING A CONVOLUTION-BASED HIERARCHICAL PACKAGING SIMULATOR, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 74-82
Authors:
EVANS RJ
FRANZON PD
Citation: Rj. Evans et Pd. Franzon, ENERGY-CONSUMPTION MODELING AND OPTIMIZATION FOR SRAMS, IEEE journal of solid-state circuits, 30(5), 1995, pp. 571-579
Authors:
LIPA S
STEER MB
MORRIS AS
FRANZON PD
Citation: S. Lipa et al., COMPARISON OF METHODS FOR DETERMINING THE CAPACITANCE OF PLANAR TRANSMISSION-LINES WITH APPLICATION TO MULTICHIP-MODULE CHARACTERIZATION, IEEE transactions on components, hybrids, and manufacturing technology, 16(3), 1993, pp. 247-252
Authors:
SIMOVICH S
FRANZON PD
STEER MB
Citation: S. Simovich et al., METHOD FOR AUTOMATED WAVE-FORM ANALYSIS OF TRANSIENT RESPONSES IN DIGITAL CIRCUITS, Electronics Letters, 29(8), 1993, pp. 681-682
Risultati:
1-7
|