Authors:
Anderson, IE
Foley, JC
Cook, BA
Harringa, J
Terpstra, RL
Unal, O
Citation: Ie. Anderson et al., Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability, J ELEC MAT, 30(9), 2001, pp. 1050-1059
Authors:
Cook, BA
Anderson, LE
Harringa, JL
Terpstra, RL
Foley, JC
Unal, O
Laabs, FC
Citation: Ba. Cook et al., Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests, J ELEC MAT, 30(9), 2001, pp. 1214-1221
Citation: O. Unal et Jc. Foley, Effects of temperature and loading rate on the shear strength and shear yield stress of lead-free 97Cu-3Sn and 95.5Cu-4Sn-0.5Ag solder alloys, J MAT SCI L, 20(17), 2001, pp. 1585-1587
Citation: Ie. Anderson et Jc. Foley, Determining the role of surfaces and interfaces in the powder metallurgy processing of aluminum alloy powders, SURF INT AN, 31(7), 2001, pp. 599-608