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Results:
1-7
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Results: 7
Authors:
Anderson, IE
Foley, JC
Cook, BA
Harringa, J
Terpstra, RL
Unal, O
Citation: Ie. Anderson et al., Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability, J ELEC MAT, 30(9), 2001, pp. 1050-1059
Authors:
Unal, O
Anderson, IE
Harringa, JL
Terpstra, RL
Cook, BA
Foley, JC
Citation: O. Unal et al., Application of an asymmetrical four point bend shear test to solder joints, J ELEC MAT, 30(9), 2001, pp. 1206-1213
Authors:
Cook, BA
Anderson, LE
Harringa, JL
Terpstra, RL
Foley, JC
Unal, O
Laabs, FC
Citation: Ba. Cook et al., Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests, J ELEC MAT, 30(9), 2001, pp. 1214-1221
Authors:
Unal, O
Foley, JC
Citation: O. Unal et Jc. Foley, Effects of temperature and loading rate on the shear strength and shear yield stress of lead-free 97Cu-3Sn and 95.5Cu-4Sn-0.5Ag solder alloys, J MAT SCI L, 20(17), 2001, pp. 1585-1587
Authors:
Anderson, IE
Foley, JC
Citation: Ie. Anderson et Jc. Foley, Determining the role of surfaces and interfaces in the powder metallurgy processing of aluminum alloy powders, SURF INT AN, 31(7), 2001, pp. 599-608
Authors:
Foley, JC
Rehbein, DK
Citation: Jc. Foley et Dk. Rehbein, Characterizing aluminum sintering using in-situ NDE, JOM-J MIN, 52(5), 2000, pp. 38-39
Authors:
Foley, JC
Gickler, A
Leprevost, FH
Brown, D
Citation: Jc. Foley et al., Analysis of ring and plug shear strengths for comparison of lead-free solders, J ELEC MAT, 29(10), 2000, pp. 1258-1263
Risultati:
1-7
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