Authors:
Hantschel, T
Slesazeck, S
Niedermann, P
Eyben, P
Vandervorst, W
Citation: T. Hantschel et al., Integrating diamond pyramids into metal cantilevers and using them as electrical AFM probes, MICROEL ENG, 57-8, 2001, pp. 749-754
Authors:
De Wolf, P
Stephenson, R
Trenkler, T
Clarysse, T
Hantschel, T
Vandevorst, W
Citation: P. De Wolf et al., Status and review of two-dimensional carrier and dopant profiling using scanning probe microscopy, J VAC SCI B, 18(1), 2000, pp. 361-368
Authors:
Trenkler, T
Hantschel, T
Stephenson, R
De Wolf, P
Vandervorst, W
Hellemans, L
Malave, A
Buchel, D
Oesterschulze, E
Kulisch, W
Niedermann, P
Sulzbach, T
Ohlsson, O
Citation: T. Trenkler et al., Evaluating probes for "electrical" atomic force microscopy, J VAC SCI B, 18(1), 2000, pp. 418-427
Authors:
Stephenson, R
De Wolf, P
Trenkler, T
Hantschel, T
Clarysse, T
Jansen, P
Vandervorst, W
Citation: R. Stephenson et al., Practicalities and limitations of scanning capacitance microscopy for routine integrated circuit characterization, J VAC SCI B, 18(1), 2000, pp. 555-559
Authors:
De Wolf, P
Geva, M
Reynolds, CL
Hantschel, T
Vandervorst, W
Bylsma, RB
Citation: P. De Wolf et al., Two-dimensional carrier profiling of InP-based structures using scanning spreading resistance microscopy., J VAC SCI A, 17(4), 1999, pp. 1285-1288
Authors:
Hantschel, T
Trenkler, T
Vandervorst, W
Malave, A
Buchel, D
Kulisch, W
Oesterschulze, E
Citation: T. Hantschel et al., Tip-on-tip: a novel AFM tip configuration for the electrical characterization of semiconductor devices, MICROEL ENG, 46(1-4), 1999, pp. 113-116