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Results: 1-25/33
Authors:
Wakil, JA
Ho, PS
Citation: Ja. Wakil et Ps. Ho, Simulating package behavior under power dissipation using uniform thermal loading, IEEE T AD P, 24(1), 2001, pp. 60-65
Authors:
Vargason, JM
Ho, PS
Citation: Jm. Vargason et Ps. Ho, Mildly eccentric 'E-DNA' - Response to Ng and Dickerson, NAT ST BIOL, 8(2), 2001, pp. 107-108
Authors:
Ho, PS
Eichman, BF
Citation: Ps. Ho et Bf. Eichman, The crystal structures of DNA Holliday junctions, CURR OP STR, 11(3), 2001, pp. 302-308
Authors:
Miller, MR
Mohammed, I
Ho, PS
Citation: Mr. Miller et al., Quantitative strain analysis of flip-chip electronic packages using phase-shifting moire interferometry, OPT LASER E, 36(2), 2001, pp. 127-139
Authors:
Vargason, JM
Henderson, K
Ho, PS
Citation: Jm. Vargason et al., A crystallographic map of the transition from B-DNA to A-DNA, P NAS US, 98(13), 2001, pp. 7265-7270
The crystal structures of psoralen cross-linked DNAs: Drug-dependent formation of Holliday junctions
Authors:
Eichman, BF
Mooers, BHM
Alberti, M
Hearst, JE
Ho, PS
Citation: Bf. Eichman et al., The crystal structures of psoralen cross-linked DNAs: Drug-dependent formation of Holliday junctions, J MOL BIOL, 308(1), 2001, pp. 15-26
Authors:
Bash, RC
Vargason, JM
Cornejo, S
Ho, PS
Lohr, D
Citation: Rc. Bash et al., Intrinsically bent DNA in the promoter regions of the yeast GAL1-10 and GAL80 genes, J BIOL CHEM, 276(2), 2001, pp. 861-866
Authors:
Gall, M
Capasso, C
Jawarani, D
Hernandez, R
Kawasaki, H
Ho, PS
Citation: M. Gall et al., Statistical analysis of early failures in electromigration, J APPL PHYS, 90(2), 2001, pp. 732-740
Authors:
Kim, MY
Maier, CS
Reed, DJ
Ho, PS
Deinzer, ML
Citation: My. Kim et al., Intramolecular interactions in chemically modified Escherichia coli thioredoxin monitored by hydrogen/deuterium exchange and electrospray ionization mass spectrometry, BIOCHEM, 40(48), 2001, pp. 14413-14421
Authors:
Lee, KD
Ogawa, ET
Matsuhashi, H
Justison, PR
Ko, KS
Ho, PS
Blaschke, VA
Citation: Kd. Lee et al., Electromigration critical length effect in Cu/oxide dual-damascene interconnects, APPL PHYS L, 79(20), 2001, pp. 3236-3238
Authors:
Ogawa, ET
Bierwag, AJ
Lee, KD
Matsuhashi, H
Justison, PR
Ramamurthi, AN
Ho, PS
Blaschke, VA
Griffiths, D
Nelsen, A
Breen, M
Havemann, RH
Citation: Et. Ogawa et al., Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects, APPL PHYS L, 78(18), 2001, pp. 2652-2654
Authors:
Wakil, J
Ho, PS
Citation: J. Wakil et Ps. Ho, Nonuniform temperature and strain fields in a powered package, IEEE T COMP, 23(3), 2000, pp. 521-527
Authors:
Dai, X
Brillhart, MV
Ho, PS
Citation: X. Dai et al., Adhesion measurement for electronic packaging applications using double cantilever beam method, IEEE T COMP, 23(1), 2000, pp. 101-116
Authors:
Dai, XS
Brillhart, MV
Roesch, M
Ho, PS
Citation: Xs. Dai et al., Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging, IEEE T COMP, 23(1), 2000, pp. 117-127
Authors:
Vargason, JM
Eichman, BF
Ho, PS
Citation: Jm. Vargason et al., The extended and eccentric E-DNA structure induced by cytosine methylationor bromination, NAT ST BIOL, 7(9), 2000, pp. 758-761
Authors:
Cho, TH
Lee, JK
Ho, PS
Ryan, ET
Pellerin, JG
Citation: Th. Cho et al., Dielectric anisotropy and molecular orientation of fluorinated polymers confined in submicron trenches, J VAC SCI B, 18(1), 2000, pp. 208-215
Authors:
Abramowitz, P
Kiene, M
Ho, PS
Citation: P. Abramowitz et al., How low-energy ions can enhance depositions on low-K dielectrics, J VAC SCI A, 18(5), 2000, pp. 2254-2261
Authors:
Ho, PS
Wang, TN
Hsieh, TK
Ko, YC
Citation: Ps. Ho et al., Differences in physician utilization between Aboriginal and non-Aboriginalchildren, FAM PRACT, 17(5), 2000, pp. 414-421
Authors:
Morgen, M
Ryan, ET
Zhao, JH
Hu, C
Cho, TH
Ho, PS
Citation: M. Morgen et al., Low dielectric constant materials for ULSI interconnects, ANN R MATER, 30, 2000, pp. 645-680
Authors:
Eichman, BF
Vargason, JM
Mooers, BHM
Ho, PS
Citation: Bf. Eichman et al., The Holliday junction in an inverted repeat DNA sequence: Sequence effectson the structure of four-way junctions, P NAS US, 97(8), 2000, pp. 3971-3976
Authors:
Zhao, JH
Ryan, T
Ho, PS
McKerrow, AJ
Shih, WY
Citation: Jh. Zhao et al., On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique, J APPL PHYS, 88(5), 2000, pp. 3029-3038
Authors:
Zhao, JH
Du, Y
Morgen, M
Ho, PS
Citation: Jh. Zhao et al., Simultaneous measurement of Young's modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates, J APPL PHYS, 87(3), 2000, pp. 1575-1577
Authors:
Zhao, JH
Kiene, M
Hu, C
Ho, PS
Citation: Jh. Zhao et al., Thermal stress and glass transition of ultrathin polystyrene films, APPL PHYS L, 77(18), 2000, pp. 2843-2845
Authors:
Hu, C
Morgen, M
Ho, PS
Jain, A
Gill, WN
Plawsky, JL
Wayner, PC
Citation: C. Hu et al., Thermal conductivity study of porous low-k dielectric materials, APPL PHYS L, 77(1), 2000, pp. 145-147
Authors:
Gall, M
Capasso, C
Jawarani, D
Hernandez, R
Kawasaki, H
Ho, PS
Citation: M. Gall et al., Detection and analysis of early failures in electromigration, APPL PHYS L, 76(7), 2000, pp. 843-845