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Results:
1-7
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Results: 7
Plasma nitridation of very thin gate dielectrics
Authors:
Al-Shareef, HN Bersuker, G Lim, C Murto, R Borthakur, S Brown, GA Huff, HR
Citation:
Hn. Al-shareef et al., Plasma nitridation of very thin gate dielectrics, MICROEL ENG, 59(1-4), 2001, pp. 317-322
Gunter Schwuttke - Obituary
Authors:
Feuersanger, AE Huff, HR
Citation:
Ae. Feuersanger et Hr. Huff, Gunter Schwuttke - Obituary, PHYS TODAY, 54(4), 2001, pp. 86
Device performance of in situ steam generated gate dielectric nitrided by remote plasma nitridation
Authors:
Al-Shareef, HN Karamcheti, A Luo, TY Bersuker, G Brown, GA Murto, RW Jackson, MD Huff, HR Kraus, P Lopes, D Olsen, C Miner, G
Citation:
Hn. Al-shareef et al., Device performance of in situ steam generated gate dielectric nitrided by remote plasma nitridation, APPL PHYS L, 78(24), 2001, pp. 3875-3877
Effect of H-2 content on reliability of ultrathin in-situ steam generated (ISSG) SiO2
Authors:
Luo, TY Laughery, M Brown, GA Al-Shareef, HN Watt, VHC Karamcheti, A Jackson, MD Huff, HR
Citation:
Ty. Luo et al., Effect of H-2 content on reliability of ultrathin in-situ steam generated (ISSG) SiO2, IEEE ELEC D, 21(9), 2000, pp. 430-432
A re-examination of silicon wafer specifications
Authors:
Huff, HR
Citation:
Hr. Huff, A re-examination of silicon wafer specifications, SOL ST TECH, 43(10), 2000, pp. 210
Characterization of 300 mm silicon-polished and EPI wafers
Authors:
Shih, S Au, C Yang, Z Messina, T Goodall, RK Huff, HR
Citation:
S. Shih et al., Characterization of 300 mm silicon-polished and EPI wafers, MICROEL ENG, 45(2-3), 1999, pp. 169-182
Oxygen precipitation behavior in 300 mm polished Czochralski silicon wafers
Authors:
Ono, T Rozgonyi, GA Au, C Messina, T Goodall, RK Huff, HR
Citation:
T. Ono et al., Oxygen precipitation behavior in 300 mm polished Czochralski silicon wafers, J ELCHEM SO, 146(10), 1999, pp. 3807-3811
Risultati:
1-7
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