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Results:
1-7
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Results: 7
Authors:
Igic, PM
Mawby, PA
Towers, MS
Batcup, S
Citation: Pm. Igic et al., Dynamic electro-thermal physically based compact models of the power devices for device and circuit simulations, P IEEE SEM, 2001, pp. 35-42
Authors:
Mawby, PA
Igic, PM
Towers, MS
Citation: Pa. Mawby et al., Physically based compact device models for circuit modelling applications, MICROELEC J, 32(5-6), 2001, pp. 433-447
Authors:
Igic, PM
Mawby, PA
Citation: Pm. Igic et Pa. Mawby, Investigation of the thermal stress field in a multilevel aluminium metallisation in VLSI systems, MICROEL REL, 40(3), 2000, pp. 443-450
Authors:
Igic, PM
Mawby, PA
Citation: Pm. Igic et Pa. Mawby, An investigation of the impact of a Ti barrier metal on the thermal stressfield in passivated aluminium lines and vias in VLSI systems using finite element modelling approach, INT J ELECT, 87(11), 2000, pp. 1289-1299
Authors:
Manic, D
Igic, PM
Mawby, PA
Haddab, Y
Popovic, RS
Citation: D. Manic et al., Mechanical stress related instabilities in silicon under metal coverage, IEEE DEVICE, 47(12), 2000, pp. 2429-2437
Authors:
Igic, PM
Mawby, PA
Citation: Pm. Igic et Pa. Mawby, Numerical modelling of stress-induced failure in sub-micron aluminium interconnects in VLSI systems, SOL ST ELEC, 43(2), 1999, pp. 255-261
Authors:
Igic, PM
Mawby, PA
Citation: Pm. Igic et Pa. Mawby, An advanced finite element strategy for thermal stress field investigationin aluminium interconnections during processing of very large scale integration multilevel structures, MICROELEC J, 30(12), 1999, pp. 1207-1212
Risultati:
1-7
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