Authors:
Letzkus, F
Butschke, J
Irmscher, M
Reuter, C
Springer, R
Eder, S
Loschner, H
Eberhardt, R
Mohaupt, M
Ehrmann, A
Mathuni, J
Panzer, B
Struck, T
Citation: F. Letzkus et al., Reference plate manufacturing process for the ion projection lithography pattern lock system, MICROEL ENG, 57-8, 2001, pp. 213-218
Authors:
Letzkus, F
Butschke, J
Hofflinger, B
Irmscher, M
Reuter, C
Springer, R
Ehrmann, A
Mathuni, J
Citation: F. Letzkus et al., Dry etch improvements in the SOI Wafer Flow Process for IPL stencil mask fabrication, MICROEL ENG, 53(1-4), 2000, pp. 609-612
Authors:
Ehrmann, A
Struck, T
Chalupka, A
Haugeneder, E
Loschner, H
Butschke, J
Irmscher, M
Letzkus, F
Springer, R
Degen, A
Rangelow, IW
Shi, F
Sossna, E
Volland, B
Engelstad, R
Lovell, E
Tejeda, R
Citation: A. Ehrmann et al., Comparison of silicon stencil mask distortion measurements with finite element analysis, J VAC SCI B, 17(6), 1999, pp. 3107-3111
Authors:
Elian, K
Irmscher, M
Butschke, J
Letzkus, F
Reuter, C
Springer, R
Citation: K. Elian et al., Comparative evaluation of electron-beam sensitive single layer top surfaceimaging and bilayer chemical amplification of resist lines process for stencil mask making, J VAC SCI B, 17(6), 1999, pp. 3122-3126