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Results:
1-6
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Results: 6
Immersion-cooled heat sinks for electronics: Insight from high-speed photography
Authors:
Bhavnani, SH Fournelle, G Jaeger, RC
Citation:
Sh. Bhavnani et al., Immersion-cooled heat sinks for electronics: Insight from high-speed photography, IEEE T COMP, 24(2), 2001, pp. 166-176
Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
Authors:
Bradley, AT Jaeger, RC Suhling, JC O'Connor, KJ
Citation:
At. Bradley et al., Piezoresistive characteristics of short-channel MOSFETs on (100) silicon, IEEE DEVICE, 48(9), 2001, pp. 2009-2015
Toward optimizing enhanced surfaces for passive immersion cooled heat sinks
Authors:
Baldwin, CS Bhavnani, SH Jaeger, RC
Citation:
Cs. Baldwin et al., Toward optimizing enhanced surfaces for passive immersion cooled heat sinks, IEEE T COMP, 23(1), 2000, pp. 70-79
The influence of Ge grading on the bias and temperature characteristics ofSiGeHBT's for precision analog circuits
Authors:
Salmon, SL Cressler, JD Jaeger, RC Harame, DL
Citation:
Sl. Salmon et al., The influence of Ge grading on the bias and temperature characteristics ofSiGeHBT's for precision analog circuits, IEEE DEVICE, 47(2), 2000, pp. 292-298
CMOS stress sensors on (100) silicon
Authors:
Jaeger, RC Suhling, JC Ramani, R Bradley, AT Xu, JP
Citation:
Rc. Jaeger et al., CMOS stress sensors on (100) silicon, IEEE J SOLI, 35(1), 2000, pp. 85-95
Neuro-fuzzy architecture for CMOS implementation
Authors:
Wilamowski, BM Jaeger, RC Kaynak, MO
Citation:
Bm. Wilamowski et al., Neuro-fuzzy architecture for CMOS implementation, IEEE IND E, 46(6), 1999, pp. 1132-1136
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