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Results: 1-14 |
Results: 14
LOW-TEMPERATURE PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION OF TANTALUMFROM TANTALUM PENTABROMIDE FOR COPPER METALLIZATION
Authors: CHEN XM FRISCH HL KALOYEROS AE ARKLES B
Citation: Xm. Chen et al., LOW-TEMPERATURE PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION OF TANTALUMFROM TANTALUM PENTABROMIDE FOR COPPER METALLIZATION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2887-2890
THE EFFECTS OF PROCESSING PARAMETERS IN THE LOW-TEMPERATURE CHEMICAL-VAPOR-DEPOSITION OF TITANIUM NITRIDE FROM TETRAIODOTITANIUM
Authors: FALTERMEIER CG GOLDBERG C JONES M UPHAM A KNORR A IVANOVA A PETERSON G KALOYEROS AE ARKLES B
Citation: Cg. Faltermeier et al., THE EFFECTS OF PROCESSING PARAMETERS IN THE LOW-TEMPERATURE CHEMICAL-VAPOR-DEPOSITION OF TITANIUM NITRIDE FROM TETRAIODOTITANIUM, Journal of the Electrochemical Society, 145(2), 1998, pp. 676-683
IN-SITU PULSED DEPOSITION STUDIES OF CE(TMHD)(4) ON SRS SURFACES FOR THIN-FILM ELECTROLUMINESCENT FLAT-PANEL DISPLAY APPLICATIONS
Authors: LAU JE BARTH KW PETERSON GG ENDISCH D TOPOL A KALOYEROS AE TUENGE RT DELAROSA M KING CN
Citation: Je. Lau et al., IN-SITU PULSED DEPOSITION STUDIES OF CE(TMHD)(4) ON SRS SURFACES FOR THIN-FILM ELECTROLUMINESCENT FLAT-PANEL DISPLAY APPLICATIONS, Journal of the Electrochemical Society, 145(12), 1998, pp. 4271-4276
INTEGRATED PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION ROUTE TO ALUMINUM INTERCONNECT AND PLUG TECHNOLOGIES FOR EMERGING COMPUTER CHIP METALLIZATION
Authors: FALTERMEIER J KNORR A TALEVI R GUNDLACH H KUMAR KA PETERSON GG KALOYEROS AE SULLIVAN JJ LOAN J
Citation: J. Faltermeier et al., INTEGRATED PLASMA-PROMOTED CHEMICAL-VAPOR-DEPOSITION ROUTE TO ALUMINUM INTERCONNECT AND PLUG TECHNOLOGIES FOR EMERGING COMPUTER CHIP METALLIZATION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(5), 1997, pp. 1758-1766
PROFILE SIMULATION OF CONFORMALITY OF CHEMICAL-VAPOR-DEPOSITED COPPERIN SUBQUARTER-MICRON TRENCH AND VIA STRUCTURES
Authors: BURKE A BRAECKELMANN G MANGER D EISENBRAUN E KALOYEROS AE MCVITTIE JP HAN J BANG D LOAN JF SULLIVAN JJ
Citation: A. Burke et al., PROFILE SIMULATION OF CONFORMALITY OF CHEMICAL-VAPOR-DEPOSITED COPPERIN SUBQUARTER-MICRON TRENCH AND VIA STRUCTURES, Journal of applied physics, 82(9), 1997, pp. 4651-4660
BARRIER PROPERTIES OF TITANIUM NITRIDE FILMS GROWN BY LOW-TEMPERATURECHEMICAL-VAPOR-DEPOSITION FROM TITANIUM TETRAIODIDE
Authors: FALTERMEIER C GOLDBERG C JONES M UPHAM A MANGER D PETERSON G LAU J KALOYEROS AE ARKLES B PARANJPE A
Citation: C. Faltermeier et al., BARRIER PROPERTIES OF TITANIUM NITRIDE FILMS GROWN BY LOW-TEMPERATURECHEMICAL-VAPOR-DEPOSITION FROM TITANIUM TETRAIODIDE, Journal of the Electrochemical Society, 144(3), 1997, pp. 1002-1008
CHEMICAL-VAPOR-DEPOSITION OF COPPER FROM CU-I HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE FOR ULTRALARGE SCALE INTEGRATION APPLICATIONS
Authors: BRAECKELMANN G MANGER D BURKE A PETERSON GG KALOYEROS AE REIDSEMA C OMSTEAD TR LOAN JF SULLIVAN JJ
Citation: G. Braeckelmann et al., CHEMICAL-VAPOR-DEPOSITION OF COPPER FROM CU-I HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE FOR ULTRALARGE SCALE INTEGRATION APPLICATIONS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(3), 1996, pp. 1828-1836
IN-SITU QUADRUPOLE MASS-SPECTROSCOPY STUDIES OF WATER AND SOLVENT COORDINATION TO COPPER(II) BETA-DIKETONATE PRECURSORS - IMPLICATIONS FOR THE CHEMICAL-VAPOR-DEPOSITION OF COPPER
Authors: ZHENG B GOLDBERG C EISENBRAUN ET LIU J KALOYEROS AE TOSCANO PJ MURARKA SP LOAN JF SULLIVAN J
Citation: B. Zheng et al., IN-SITU QUADRUPOLE MASS-SPECTROSCOPY STUDIES OF WATER AND SOLVENT COORDINATION TO COPPER(II) BETA-DIKETONATE PRECURSORS - IMPLICATIONS FOR THE CHEMICAL-VAPOR-DEPOSITION OF COPPER, Materials chemistry and physics, 41(3), 1995, pp. 173-181
IN-SITU MASS-SPECTRAL AND IR STUDIES OF THE ROLE OF AUXILIARY REAGENTS IN THE ENHANCEMENT OF COPPER GROWTH IN THE CHEMICAL-VAPOR-DEPOSITIONOF CU(II) BETA-DIKETONATE PRECURSORS
Authors: KALOYEROS AE ZHENG B LOU IS LAU J HELLGETH JW
Citation: Ae. Kaloyeros et al., IN-SITU MASS-SPECTRAL AND IR STUDIES OF THE ROLE OF AUXILIARY REAGENTS IN THE ENHANCEMENT OF COPPER GROWTH IN THE CHEMICAL-VAPOR-DEPOSITIONOF CU(II) BETA-DIKETONATE PRECURSORS, Thin solid films, 262(1-2), 1995, pp. 20-30
THERMAL-STABILITY OF ON-CHIP COPPER INTERCONNECT STRUCTURES
Authors: GUTMANN RJ CHOW TP KALOYEROS AE LANFORD WA MURAKA SP
Citation: Rj. Gutmann et al., THERMAL-STABILITY OF ON-CHIP COPPER INTERCONNECT STRUCTURES, Thin solid films, 262(1-2), 1995, pp. 177-186
IN-SITU MASS-SPECTRAL AND INFRARED STUDIES OF THE GAS-PHASE EVOLUTIONAND DECOMPOSITION PATHWAYS OF CU-II(HFAC)(2) - APPLICATION IN THE DEVELOPMENT OF PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION OF COPPER
Authors: ZHENG B BRAECKELMANN G KUJAWSKI K LOU I LANE S KALOYEROS AE
Citation: B. Zheng et al., IN-SITU MASS-SPECTRAL AND INFRARED STUDIES OF THE GAS-PHASE EVOLUTIONAND DECOMPOSITION PATHWAYS OF CU-II(HFAC)(2) - APPLICATION IN THE DEVELOPMENT OF PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION OF COPPER, Journal of the Electrochemical Society, 142(11), 1995, pp. 3896-3903
CHEMICAL-VAPOR-DEPOSITION OF COPPER FOR MULTILEVEL METALLIZATION
Authors: KALOYEROS AE FURY MA
Citation: Ae. Kaloyeros et Ma. Fury, CHEMICAL-VAPOR-DEPOSITION OF COPPER FOR MULTILEVEL METALLIZATION, MRS bulletin, 18(6), 1993, pp. 22-29
ADVANCED MULTILAYER METALLIZATION SCHEMES WITH COPPER AS INTERCONNECTION METAL
Authors: MURARKA SP GUTMANN RJ KALOYEROS AE LANFORD WA
Citation: Sp. Murarka et al., ADVANCED MULTILAYER METALLIZATION SCHEMES WITH COPPER AS INTERCONNECTION METAL, Thin solid films, 236(1-2), 1993, pp. 257-266
ON THE EFFECT OF PROCESSING PARAMETERS IN THE CHEMICAL-VAPOR-DEPOSITION OF YBA2CU3O7-DELTA THIN-FILMS ON POLYCRYSTALLINE SILVER
Authors: CHEN L PIAZZA TW SCHMIDT BE KELSEY JE KALOYEROS AE HAZELTON DW WALKER MS LUO L DYE RC MAGGIORE CJ WILKINS DJ KNORR DB
Citation: L. Chen et al., ON THE EFFECT OF PROCESSING PARAMETERS IN THE CHEMICAL-VAPOR-DEPOSITION OF YBA2CU3O7-DELTA THIN-FILMS ON POLYCRYSTALLINE SILVER, Journal of applied physics, 73(11), 1993, pp. 7563-7570
Risultati: 1-14 |