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Results: 1-25/28
Authors:
KNORR DB
MERCHANT SM
BIBERGER MA
Citation: Db. Knorr et al., DEVELOPMENT OF TEXTURE IN INTERCONNECT THIN-FILM STACKS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2734-2744
Authors:
YU JS
MANIATTY AM
KNORR DB
Citation: Js. Yu et al., MODEL FOR PREDICTING THERMAL-STRESSES IN THIN POLYCRYSTALLINE FILMS, Journal of the mechanics and physics of solids, 45(4), 1997, pp. 511-534
Authors:
FOX TR
KNORR DB
STOLOFF NS
Citation: Tr. Fox et al., EFFECTS OF ENVIRONMENT AND HEAT-TREATMENT ON THE TENSILE AND FATIGUE PROPERTIES OF TI-24 AT-PERCENT-AL-11 AT-PERCENT-NB, Fatigue & fracture of engineering materials & structures, 19(11), 1996, pp. 1339-1355
Authors:
KNORR DB
RODBELL KP
Citation: Db. Knorr et Kp. Rodbell, THE ROLE OF TEXTURE IN THE ELECTROMIGRATION BEHAVIOR OF PURE ALUMINUMLINES, Journal of applied physics, 79(5), 1996, pp. 2409-2417
Authors:
KNORR DB
Citation: Db. Knorr, THE MULTICHIP-MODULE AS A BOARD-LEVEL PACKAGE, JOM, 47(6), 1995, pp. 27-30
Authors:
DEANGELIS RJ
KNORR DB
MERCHANT HD
Citation: Rj. Deangelis et al., THROUGH-THICKNESS CHARACTERIZATION OF COPPER ELECTRODEPOSIT, Journal of electronic materials, 24(8), 1995, pp. 927-933
Authors:
KNORR DB
TRACY DP
Citation: Db. Knorr et Dp. Tracy, A REVIEW OF MICROSTRUCTURE IN VAPOR-DEPOSITED COPPER THIN-FILMS, Materials chemistry and physics, 41(3), 1995, pp. 206-216
Authors:
LEE KT
SZPUNAR JA
MORAWIEC A
KNORR DB
RODBELL KP
Citation: Kt. Lee et al., CORRELATION BETWEEN SPECIAL GRAIN-BOUNDARIES AND ELECTROMIGRATION BEHAVIOR OF ALUMINUM THIN-FILMS, Canadian metallurgical quarterly, 34(3), 1995, pp. 287-292
Authors:
LIU WT
LAKSHMIKUMAR ST
KNORR DB
RYMASZEWSKI EJ
LU TM
BAKHRU H
Citation: Wt. Liu et al., THERMALLY STABLE AMORPHOUS BAXTI2-XOY THIN-FILMS, Applied physics letters, 66(7), 1995, pp. 809-811
Authors:
SINGH PK
COCHRANE S
LIU WT
CHEN K
KNORR DB
BORREGO JM
RYMASZEWSKI EJ
LU TM
Citation: Pk. Singh et al., HIGH-FREQUENCY RESPONSE OF CAPACITORS FABRICATED FROM FINE-GRAIN BATIO3 THIN-FILMS, Applied physics letters, 66(26), 1995, pp. 3683-3685
Authors:
KNORR DB
WEILAND H
Citation: Db. Knorr et H. Weiland, PRACTICAL APPLICATIONS IN TEXTURE ANALYSIS, JOM, 46(9), 1994, pp. 31-31
Authors:
KNORR DB
WEILAND H
SZPUNAR JA
Citation: Db. Knorr et al., APPLYING TEXTURE ANALYSIS TO MATERIALS ENGINEERING PROBLEMS, JOM, 46(9), 1994, pp. 32-36
Authors:
KNORR DB
SZPUNAR JA
Citation: Db. Knorr et Ja. Szpunar, APPLICATIONS OF TEXTURE IN THIN-FILMS, JOM, 46(9), 1994, pp. 42-48
Authors:
RAEDER CH
FELTON LE
TANZI VA
KNORR DB
Citation: Ch. Raeder et al., THE EFFECT OF AGING ON MICROSTRUCTURE, ROOM-TEMPERATURE DEFORMATION, AND FRACTURE OF SN-BI CU SOLDER JOINTS/, Journal of electronic materials, 23(7), 1994, pp. 611-617
Authors:
RAJAN K
KNORR DB
SANCHEZ JE
Citation: K. Rajan et al., SPECIAL SECTION ON THE DEVELOPMENT OF MICROSTRUCTURE IN DEPOSITED THIN-FILMS - FOREWORD, Journal of electronic materials, 23(10), 1994, pp. 997-997
Authors:
TRACY DP
KNORR DB
RODBELL KP
Citation: Dp. Tracy et al., TEXTURE IN MULTILAYER METALLIZATION STRUCTURES, Journal of applied physics, 76(5), 1994, pp. 2671-2680
Authors:
LIU WT
COCHRANE S
WU XM
SINGH PK
ZHANG X
KNORR DB
MCDONALD JF
RYMASZEWSKI EJ
BORREGO JM
LU TM
Citation: Wt. Liu et al., FREQUENCY-DOMAIN (1KHZ-40GHZ) CHARACTERIZATION OF THIN-FILMS FOR MULTICHIP-MODULE PACKAGING TECHNOLOGY, Electronics Letters, 30(2), 1994, pp. 117-118
Authors:
HARPER JME
GUPTA J
SMITH DA
CHANG JW
HOLLOWAY KL
CABRAL C
TRACY DP
KNORR DB
Citation: Jme. Harper et al., CRYSTALLOGRAPHIC TEXTURE CHANGE DURING ABNORMAL GRAIN-GROWTH IN CU-COTHIN-FILMS, Applied physics letters, 65(2), 1994, pp. 177-179
Authors:
YOU L
YANG GR
KNORR DB
MCDONALD JF
LU TM
Citation: L. You et al., TEXTURE OF VAPOR-DEPOSITED PARYLENE THIN-FILMS, Applied physics letters, 64(21), 1994, pp. 2812-2814
Authors:
FELTON LE
RAEDER CH
KNORR DB
Citation: Le. Felton et al., THE PROPERTIES OF TIN-BISMUTH ALLOY SOLDERS, JOM, 45(7), 1993, pp. 28-32
Authors:
LIU WT
COCHRANE S
LAKSHMIKUMAR ST
KNORR DB
RYMASZEWSKI EJ
BORREGO JM
LU TM
Citation: Wt. Liu et al., LOW-TEMPERATURE FABRICATION OF AMORPHOUS BATIO3 THIN-FILM BYPASS CAPACITORS, IEEE electron device letters, 14(7), 1993, pp. 320-322
Authors:
KNORR DB
MERCHANT HD
Citation: Db. Knorr et Hd. Merchant, SPECIAL ISSUE ON DEVELOPMENT OF MICROSTRUCTURE AND TEXTURE IN MATERIALS FOR ELECTRONIC APPLICATIONS - FOREWORD, Journal of electronic materials, 22(6), 1993, pp. 579-579
Authors:
CAMPBELL AN
MIKAWA RE
KNORR DB
Citation: An. Campbell et al., RELATIONSHIP BETWEEN TEXTURE AND ELECTROMIGRATION LIFETIME IN SPUTTERED AL-1-PERCENT SI THIN-FILMS, Journal of electronic materials, 22(6), 1993, pp. 589-596
Authors:
RODBELL KP
KNORR DB
MIS JD
Citation: Kp. Rodbell et al., THE MICROSTRUCTURE, MECHANICAL-STRESS, TEXTURE, AND ELECTROMIGRATION BEHAVIOR OF AL-PD ALLOYS, Journal of electronic materials, 22(6), 1993, pp. 597-606
Authors:
TRACY DP
KNORR DB
Citation: Dp. Tracy et Db. Knorr, TEXTURE AND MICROSTRUCTURE OF THIN COPPER-FILMS, Journal of electronic materials, 22(6), 1993, pp. 611-616