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Results:
1-23
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Results: 23
Authors:
Kim, YC
Kim, CI
Citation: Yc. Kim et Ci. Kim, Etching mechanism Of Y2O3 thin films in high density Cl-2/Ar plasma, J VAC SCI A, 19(5), 2001, pp. 2676-2679
Authors:
Choi, SK
Kim, DP
Kim, CI
Chang, EG
Citation: Sk. Choi et al., Damage in etching of (Ba,Sr)TiO3 thin films using inductively coupled plasma, J VAC SCI A, 19(4), 2001, pp. 1063-1067
Authors:
Oh, CS
Kim, CI
Kwon, KH
Citation: Cs. Oh et al., Etch characteristics of CeO2 thin films as a buffer layer for the application of ferroelectric random access memory, J VAC SCI A, 19(4), 2001, pp. 1068-1071
Authors:
Min, BJ
Kim, CI
Kim, YT
Citation: Bj. Min et al., Etching mechanism of YMnO3 thin films in Cl-2/Ar gas chemistries, J VAC SCI A, 19(4), 2001, pp. 1289-1293
Authors:
Brehob, EG
Kim, CI
Kulkarni, AK
Citation: Eg. Brehob et al., Numerical model of upward flame spread on practical wall materials, FIRE SAFE J, 36(3), 2001, pp. 225-240
Authors:
Kim, DP
Kim, CI
Citation: Dp. Kim et Ci. Kim, Etching properties of SrBi2Ta2O9 thin films using CF4/Ar magnetically enhanced inductively coupled plasmas for FRAM, J KOR PHYS, 39(1), 2001, pp. 189-192
Authors:
Kim, SB
Min, BJ
Kim, DP
Kim, CI
Citation: Sb. Kim et al., Effects of BCl3 addition in Cl-2/Ar plasma etching of (Ba,Sr)TiO3 thin films, J KOR PHYS, 38(3), 2001, pp. 264-267
Authors:
Kim, DP
Kim, CI
Citation: Dp. Kim et Ci. Kim, The etching characteristics of SrBi2Ta2O9 thin film in CF4/Ar plasma usingmagnetically enhanced inductively coupled plasma, THIN SOL FI, 385(1-2), 2001, pp. 162-166
Authors:
Kim, SC
Ahn, TY
Choi, HK
Choi, NG
Chung, TG
Chung, WS
Hwang, TK
Hyun, JS
Jung, GW
Kim, CI
Kim, JJ
Kim, SW
Lee, CH
Lee, KS
Lee, WH
Min, KS
Moon, KH
Paick, JS
Park, KS
Park, NC
Park, YK
Seo, JK
Seo, KK
Shin, JS
Yoon, YR
Lee, WC
Citation: Sc. Kim et al., Multicenter study of the treatment of erectile dysfunction with transurethral alprostadil (MUSE) in Korea, INT J IMPOT, 12(2), 2000, pp. 97-101
Authors:
An, TH
Park, JY
Yeom, GY
Chang, EG
Kim, CI
Citation: Th. An et al., Effects of BCl3 addition on Ar/Cl-2 gas in inductively coupled plasmas forlead zirconate titanate etching (vol 18, pg 1373, 2000), J VAC SCI A, 18(6), 2000, pp. 3012-3013
Authors:
Seo, JW
Lee, DH
Lee, WJ
Yu, BG
Kwon, KH
Yeom, GY
Chang, EG
Kim, CI
Citation: Jw. Seo et al., Etching characteristics of SrBi(2)Ya(2)O(9) film with Ar/CHF3 plasma, J VAC SCI A, 18(4), 2000, pp. 1354-1358
Authors:
An, TH
Park, JY
Yeom, GY
Chang, EG
Kim, CI
Citation: Th. An et al., Effects of BCl3 addition on Ar/Cl-2 gas in inductively coupled plasmas forlead zirconate titanate etching, J VAC SCI A, 18(4), 2000, pp. 1373-1376
Authors:
Ryu, JH
Kim, NH
Kim, HS
Yeom, GY
Chang, EG
Kim, CI
Citation: Jh. Ryu et al., Roles of N-2 gas in etching of platinum by inductively coupled Ar/Cl-2/N-2plasmas, J VAC SCI A, 18(4), 2000, pp. 1377-1380
Authors:
Kim, SB
Lee, YH
Kim, TH
Yeom, GY
Kim, CI
Citation: Sb. Kim et al., Etching mechanism of (Ba,Sr)TiO3 films in high density Cl-2/BCl3/Ar plasma, J VAC SCI A, 18(4), 2000, pp. 1381-1384
Authors:
Yu, IK
Kim, CI
Song, YH
Citation: Ik. Yu et al., A novel short-term load forecasting technique using wavelet transform analysis, ELEC MACH P, 28(6), 2000, pp. 537-549
Authors:
Kye, SH
Kim, CI
Lee, HS
Yoon, JS
Smiciklas-Wright, H
Mitchell, DC
Kim, JH
Citation: Sh. Kye et al., Food consumption patterns by urban elders in Korea, ECOL FOOD N, 39(4), 2000, pp. 293-310
Authors:
Baek, KH
Yoon, YS
Park, JM
Kwon, KH
Kim, CI
Nam, KS
Citation: Kh. Baek et al., Corrosion at the grain boundary and a fluorine-related passivation layer on etched Al-Cu (1%) alloy surfaces, ETRI J, 21(3), 1999, pp. 16-21
Authors:
Kim, SB
Kim, CI
Chang, EG
Yeom, GY
Citation: Sb. Kim et al., Study on surface reaction of (Ba,Sr)TiO3 thin films by high density plasmaetching, J VAC SCI A, 17(4), 1999, pp. 2156-2161
Authors:
Kim, SG
Baek, KH
Kim, J
Koo, JG
Kim, DY
Kim, IS
Kwon, KH
Kim, CI
Citation: Sg. Kim et al., Suppression of corrosion phenomenon on Al-1 %Cu surface with fluorine treatment, J KOR PHYS, 35, 1999, pp. S357-S360
Authors:
Kim, SB
Chang, EG
Kim, CI
Citation: Sb. Kim et al., The etching mechanism of (Ba,Sr)TiO3 films using Cl-2/Ar inductively coupled plasma, J KOR PHYS, 35, 1999, pp. S716-S720
Authors:
Kim, NH
Kim, CI
Chang, EG
Kwon, KH
Citation: Nh. Kim et al., A study on the suppression of etch residues by O-2 gas addition in dry etching of Pt film, J KOR PHYS, 35, 1999, pp. S806-S809
Authors:
Yoon, YS
Baek, KH
Park, JM
Kwon, KH
Kim, CI
Hwang, IG
Citation: Ys. Yoon et al., Angle-resolved XPS investigation of the fluorine-related passivation layeron etched Al (Cu 1%) surface after SF6 treatment, J KOR PHYS, 34, 1999, pp. S305-S309
Authors:
Baek, KH
Yun, SJ
Park, JM
Yoon, YS
Nam, KS
Kwon, KH
Kim, CI
Citation: Kh. Baek et al., The role of sulfur during Mo etching using SF6 and Cl-2 gas chemistries, J MAT SCI L, 17(17), 1998, pp. 1483-1486
Risultati:
1-23
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