Authors:
Hsu, DT
Shi, FG
Lopatin, S
Shacham-Diamand, Y
Zhao, B
Brongo, M
Vasudev, PK
Citation: Dt. Hsu et al., Electroless copper deposition solution induced chemical changes in low-k fluorinated dielectrics, MAT SC S PR, 2(1), 1999, pp. 19-22
Authors:
Vanasupa, L
Pinck, D
Joo, YC
Nogami, T
Pramanick, S
Lopatin, S
Yang, K
Citation: L. Vanasupa et al., The impact of linewidth and line density on the texture of electroplated Cu in Damascene-fabricated lines, EL SOLID ST, 2(6), 1999, pp. 275-277
Authors:
Hsu, DT
Shi, FG
Lopatin, S
Shacham-Diamand, Y
Zhao, B
Brongo, M
Vasudev, PK
Citation: Dt. Hsu et al., Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment, J MAT SCI L, 18(18), 1999, pp. 1465-1467
Authors:
Hsu, DT
Iskandar, M
Shi, FG
Lopatin, S
Shacham-Diamand, Y
Tong, HY
Zhao, B
Brongo, M
Vasudev, PK
Citation: Dt. Hsu et al., Compatibility of the low-dielectric-constant poly(arylether) with the electroless copper deposition solution, J ELCHEM SO, 146(12), 1999, pp. 4565-4568