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Results: 1-5 |
Results: 5

Authors: Hsu, DT Shi, FG Lopatin, S Shacham-Diamand, Y Zhao, B Brongo, M Vasudev, PK
Citation: Dt. Hsu et al., Electroless copper deposition solution induced chemical changes in low-k fluorinated dielectrics, MAT SC S PR, 2(1), 1999, pp. 19-22

Authors: Vanasupa, L Pinck, D Joo, YC Nogami, T Pramanick, S Lopatin, S Yang, K
Citation: L. Vanasupa et al., The impact of linewidth and line density on the texture of electroplated Cu in Damascene-fabricated lines, EL SOLID ST, 2(6), 1999, pp. 275-277

Authors: Hsu, DT Shi, FG Lopatin, S Shacham-Diamand, Y Zhao, B Brongo, M Vasudev, PK
Citation: Dt. Hsu et al., Change in chemical state of fluorinated polyimides after the electroless Cu deposition solution treatment, J MAT SCI L, 18(18), 1999, pp. 1465-1467

Authors: Shacham-Diamand, Y Lopatin, S
Citation: Y. Shacham-diamand et S. Lopatin, Integrated electroless metallization for ULSI, ELECTR ACT, 44(21-22), 1999, pp. 3639-3649

Authors: Hsu, DT Iskandar, M Shi, FG Lopatin, S Shacham-Diamand, Y Tong, HY Zhao, B Brongo, M Vasudev, PK
Citation: Dt. Hsu et al., Compatibility of the low-dielectric-constant poly(arylether) with the electroless copper deposition solution, J ELCHEM SO, 146(12), 1999, pp. 4565-4568
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