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Results: 1-8 |
Results: 8
CU-CVD PROCESS OPTIMIZED IN A CLUSTER EQUIPMENT FOR IC MANUFACTURING
Authors: MARCADAL C RICHARD E MERMET JL TORRES J PALLEAU J ALAUX B BAKLI M
Citation: C. Marcadal et al., CU-CVD PROCESS OPTIMIZED IN A CLUSTER EQUIPMENT FOR IC MANUFACTURING, Microelectronic engineering, 33(1-4), 1997, pp. 3-13
ULTRA-THIN DIFFUSION-BARRIERS FOR CU INTERCONNECTIONS AT THE GIGABIT GENERATION AND BEYOND
Authors: BRAUD F TORRES J PALLEAU J MERMET JL MARCADAL C RICHARD E
Citation: F. Braud et al., ULTRA-THIN DIFFUSION-BARRIERS FOR CU INTERCONNECTIONS AT THE GIGABIT GENERATION AND BEYOND, Microelectronic engineering, 33(1-4), 1997, pp. 293-300
COPPER-BASED METALLIZATION FOR ULSI CIRCUITS
Authors: TORRES J MERMET JL MADAR R CREAN G GESSNER T BERTZ A HASSE W PLOTNER M BINDER F SAVE D
Citation: J. Torres et al., COPPER-BASED METALLIZATION FOR ULSI CIRCUITS, Microelectronic engineering, 34(1), 1996, pp. 119-122
CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN
Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN
Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN
Authors: MOUCHE MJ MERMET JL PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Mj. Mouche et al., PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN, Applied surface science, 91(1-4), 1995, pp. 129-133
TI-DIFFUSION BARRIER IN CU-BASED METALLIZATION
Authors: BRAUD F TORRES J PALLEAU J MERMET JL MOUCHE MJ
Citation: F. Braud et al., TI-DIFFUSION BARRIER IN CU-BASED METALLIZATION, Applied surface science, 91(1-4), 1995, pp. 251-256
METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION OF COPPER USING HYDRATED COPPER FORMATE AS A NEW PRECURSOR
Authors: MOUCHE MJ MERMET JL ROMAND M CHARBONNIER M
Citation: Mj. Mouche et al., METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION OF COPPER USING HYDRATED COPPER FORMATE AS A NEW PRECURSOR, Thin solid films, 262(1-2), 1995, pp. 1-6
Risultati: 1-8 |