Authors: Yun, CS Malberti, P Ciappa, M Fichtner, W

Citation: Cs. Yun et al., Thermal component model for electrothermal analysis of IGBT module systems, IEEE T AD P, 24(3), 2001, pp. 401-406

Authors: Malberti, P Ciampolini, L Ciappa, M Fichtner, W

Citation: P. Malberti et al., Quantification of scanning capacitance microscopy measurements for 2D dopant profiling, MICROEL REL, 40(8-10), 2000, pp. 1395-1399

Authors: Meneghesso, G Ciappa, M Malberti, P Sponton, L Croce, G Contiero, C Zanoni, E

Citation: G. Meneghesso et al., Overstress and electrostatic discharge in CMOS and BCD integrated circuits, MICROEL REL, 40(8-10), 2000, pp. 1739-1746

Authors: Ciappa, M Malberti, P Fichtner, W Cova, P Cattani, L Fantini, F

Citation: M. Ciappa et al., Lifetime extrapolation for IGBT modules under realistic operation conditions, MICROEL REL, 39(6-7), 1999, pp. 1131-1136

Authors: Ciampolini, L Ciappa, M Malberti, P Regli, P Fichtner, W

Citation: L. Ciampolini et al., Modelling thermal effects of large contiguous voids in solder joints, MICROELEC J, 30(11), 1999, pp. 1115-1123