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Results: 1-12 |
Results: 12
Superconformal electrodeposition of copper (vol 4, pg C26, 2001)
Authors: Moffat, TP Wheeler, D Huber, WH Josell, D
Citation: Tp. Moffat et al., Superconformal electrodeposition of copper (vol 4, pg C26, 2001), EL SOLID ST, 4(8), 2001, pp. L5-L5
Superconformal electrodeposition of copper
Authors: Moffat, TP Wheeler, D Huber, WH Josell, D
Citation: Tp. Moffat et al., Superconformal electrodeposition of copper, EL SOLID ST, 4(4), 2001, pp. C26-C29
Superconformal electrodeposition in submicron features - art. no. 016102
Authors: Josell, D Wheeler, D Huber, WH Moffat, TP
Citation: D. Josell et al., Superconformal electrodeposition in submicron features - art. no. 016102, PHYS REV L, 8701(1), 2001, pp. 6102-NIL_92
Correlation between structural imperfection and giant magnetoresistance inelectrodeposited Co/Cu multilayers
Authors: Shima, M Salamanca-Riba, LG McMichael, RD Moffat, TP
Citation: M. Shima et al., Correlation between structural imperfection and giant magnetoresistance inelectrodeposited Co/Cu multilayers, J ELCHEM SO, 148(8), 2001, pp. C518-C523
A simple equation for predicting superconformal electrodeposition in submicrometer trenches
Authors: Josell, D Wheeler, D Huber, WH Bonevich, JE Moffat, TP
Citation: D. Josell et al., A simple equation for predicting superconformal electrodeposition in submicrometer trenches, J ELCHEM SO, 148(12), 2001, pp. C767-C773
Ballistic magnetoresistance in a nanocontact between a Ni cluster and a magnetic thin film
Authors: Munoz, M Qian, GG Karar, N Cheng, H Saveliev, IG Garcia, N Moffat, TP Chen, PJ Gan, L Egelhoff, WF
Citation: M. Munoz et al., Ballistic magnetoresistance in a nanocontact between a Ni cluster and a magnetic thin film, APPL PHYS L, 79(18), 2001, pp. 2946-2948
Superconformal electrodeposition of copper in 500-90 nm features
Authors: Moffat, TP Bonevich, JE Huber, WH Stanishevsky, A Kelly, DR Stafford, GR Josell, D
Citation: Tp. Moffat et al., Superconformal electrodeposition of copper in 500-90 nm features, J ELCHEM SO, 147(12), 2000, pp. 4524-4535
Dissolution dynamics of artificially structured materials
Authors: Shima, M Salamanca-Riba, L Moffat, TP
Citation: M. Shima et al., Dissolution dynamics of artificially structured materials, EL SOLID ST, 2(6), 1999, pp. 271-274
Structural and magnetic properties of electrodeposited Co Cu multilayers
Authors: Shima, M Salamanca-Riba, L Moffat, TP McMichael, RD
Citation: M. Shima et al., Structural and magnetic properties of electrodeposited Co Cu multilayers, J MAGN MAGN, 199, 1999, pp. 52-54
Direct experimental study of the microscopic remagnetization mechanism in Co Cu magnetic superlattices
Authors: Nikitenko, VI Gornakov, VS Dedukh, LM Khapikov, AF Moffat, TP Shapiro, AJ Shull, RD Shima, M Salamanca-Riba, L
Citation: Vi. Nikitenko et al., Direct experimental study of the microscopic remagnetization mechanism in Co Cu magnetic superlattices, J MAGN MAGN, 199, 1999, pp. 477-479
Scanning tunneling microscopy studies of metal electrodes
Authors: Moffat, TP
Citation: Tp. Moffat, Scanning tunneling microscopy studies of metal electrodes, ELECTROAN C, 21, 1999, pp. 211-316
Oxidative chloride adsorption and lead upd on Cu(100): Investigations intosurfactant-assisted epitaxial growth
Authors: Moffat, TP
Citation: Tp. Moffat, Oxidative chloride adsorption and lead upd on Cu(100): Investigations intosurfactant-assisted epitaxial growth, J PHYS CH B, 102(49), 1998, pp. 10020-10026
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