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Authors: PECHT M BOULLIE J HAKIM E JAIN AK JACKSON M KNOWLES I SCHROEDER R STRANGE AD WYLER J
Citation: M. Pecht et al., THE REALISM OF FAA RELIABILITY-SAFETY REQUIREMENTS AND ALTERNATIVES, IEEE aerospace and electronic systems magazine, 13(2), 1998, pp. 16-20

Authors: WILLIAMS R BANNER J KNOWLES I DUBE M NATISHAN M PECHT M
Citation: R. Williams et al., AN INVESTIGATION OF CANNOT DUPLICATE FAILURES, Quality and reliability engineering international, 14(5), 1998, pp. 331-337

Authors: SHARMA P UPADHYAYULA K LANTZ L PECHT M
Citation: P. Sharma et al., IMPACT OF PRECONDITIONING, VOLTAGE BIAS AND TEMPERATURE ON RELIABILITY OF PLASTIC ENCAPSULATED MICROCIRCUITS, Microelectronics and reliability, 38(4), 1998, pp. 581-584

Authors: MAHAJAN R PECHT M
Citation: R. Mahajan et M. Pecht, RELIABILITY ASSESSMENT OF A PLASTIC ENCAPSULATED RF SWITCHING DEVICE, Microelectronics and reliability, 38(10), 1998, pp. 1607-1610

Authors: STOJADINOVIC N PECHT M
Citation: N. Stojadinovic et M. Pecht, UNTITLED, Microelectronics and reliability, 38(1), 1998, pp. 3-3

Authors: SINNADURAI N SHUKLA AA PECHT M
Citation: N. Sinnadurai et al., A CRITIQUE OF THE RELIABILITY-ANALYSIS-CENTER FAILURE-RATE-MODEL FOR PLASTIC ENCAPSULATED MICROCIRCUITS, IEEE transactions on reliability, 47(2), 1998, pp. 110-113

Authors: KELKAR N DASGUPTA A PECHT M KNOWLES I HAWLEY M JENNINGS D
Citation: N. Kelkar et al., SMART ELECTRONIC SYSTEMS FOR CONDITION-BASED HEALTH MANAGEMENT, Quality and reliability engineering international, 13(1), 1997, pp. 3-8

Authors: STOJADINOVIC N PECHT M
Citation: N. Stojadinovic et M. Pecht, UNTITLED, Microelectronics and reliability, 37(1), 1997, pp. 3-5

Authors: PECHT M
Citation: M. Pecht, OPEN FORUM, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 570-570

Authors: PECHT M
Citation: M. Pecht, EDITORIAL, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(3), 1996, pp. 441-441

Authors: GANNAMANI R PECHT M
Citation: R. Gannamani et M. Pecht, AN EXPERIMENTAL-STUDY OF POPCORNING IN PLASTIC ENCAPSULATED MICROCIRCUITS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 194-201

Authors: PECHT M
Citation: M. Pecht, OPEN FORUM, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 276-276

Authors: RASHID G OPHIR R PECHT M LOURIE S MESHORER A BENEFRAIM S TRAININ N BURSTEIN Y KEISARI Y
Citation: G. Rashid et al., INHIBITION OF MURINE LEWIS LUNG-CARCINOMA METASTASES BY COMBINED CHEMOTHERAPY AND INTRANASAL THF-GAMMA-2 IMMUNOTHERAPY, Journal of immunotherapy with emphasis on tumor immunology, 19(5), 1996, pp. 324-333

Authors: OPHIR R PECHT M KEISARI Y RASHID G LOURIE S MESHORER A BENEFRAIM S TRAININ N BURSTEIN Y
Citation: R. Ophir et al., THYMIC HUMORAL FACTOR-GAMMA-2 (THF-GAMMA-2) IMMUNOTHERAPY REDUCES THEMETASTATIC LOAD AND RESTORES IMMUNOCOMPETENCE IN 3LL TUMOR-BEARING MICE RECEIVING ANTICANCER CHEMOTHERAPY, Immunopharmacology and immunotoxicology, 18(2), 1996, pp. 209-236

Authors: PALMON A BLAGERMAN S TELOR S PECHT M TRAININ N BURSTEIN Y RAGERZISMAN B
Citation: A. Palmon et al., TREATMENT OF MURINE CYTOMEGALOVIRUS SALIVARY-GLAND INFECTION BY COMBINED THERAPY WITH GANCICLOVIR AND THYMIC HUMORAL FACTOR GAMMA-2, Antiviral research, 33(1), 1996, pp. 55-64

Authors: PALMON A TELOR S BLAGERMAN S PECHT M TRAININ N BURSTEIN Y RAGERZISMAN B
Citation: A. Palmon et al., CYTOKINE MESSENGER-RNA EXPRESSION DURING GANCICLOVIR AND THYMIC HUMORAL FACTOR GAMMA-2 TREATMENT OF CMV INFECTION IN MURINE SALIVARY-GLAND MODEL, Journal of dental research, 75(5), 1996, pp. 1252-1252

Authors: PECHT M WU X PAIK KW BHANDARKAR SN
Citation: M. Pecht et al., TO CUT OR NOT TO CUT - A THERMOMECHANICAL STRESS-ANALYSIS OF POLYIMIDE THIN-FILM ON CERAMIC STRUCTURES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 150-153

Authors: PECHT M DASGUPTA A
Citation: M. Pecht et A. Dasgupta, PHYSICS-OF-FAILURE - AN APPROACH TO RELIABLE PRODUCT DEVELOPMENT, Journal of the IES, 38(5), 1995, pp. 30-34

Authors: LI MJ PECHT M
Citation: Mj. Li et M. Pecht, ENVIRONMENTAL SCANNING ELECTRON-MICROSCOPIC INVESTIGATION OF FAILURE MECHANISMS IN ELECTRONIC PACKAGES, Journal of electronic packaging, 117(3), 1995, pp. 225-229

Authors: LALL P PECHT M HAKIM EB
Citation: P. Lall et al., CHARACTERIZATION OF FUNCTIONAL-RELATIONSHIP BETWEEN TEMPERATURE AND MICROELECTRONIC RELIABILITY, Microelectronics and reliability, 35(3), 1995, pp. 377-402

Authors: PECHT M WU X
Citation: M. Pecht et X. Wu, CHARACTERIZATION OF POLYIMIDES USED IN HIGH-DENSITY INTERCONNECTS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 632-639

Authors: RUDRA B PECHT M JENNINGS D
Citation: B. Rudra et al., ASSESSING TIME-TO-FAILURE DUE TO CONDUCTIVE FILAMENT FORMATION IN MULTILAYER ORGANIC LAMINATES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(3), 1994, pp. 269-276

Authors: PECHT M BARKER D LALL P
Citation: M. Pecht et al., DEVELOPMENT OF AN ALTERNATIVE WIRE BOND TEST TECHNIQUE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(4), 1994, pp. 610-615

Authors: POURBABAI B PECHT M
Citation: B. Pourbabai et M. Pecht, MANAGEMENT OF DESIGN ACTIVITIES IN A CONCURRENT ENGINEERING ENVIRONMENT, International Journal of Production Research, 32(4), 1994, pp. 821-832

Authors: PECHT M LOURIE S BURSTEIN Y ZIPORI D TRAININ N
Citation: M. Pecht et al., POTENTIATION OF MYELOID COLONY-FORMATION IN BONE-MARROW OF INTACT ANDNEONATALLY THYMECTOMIZED MICE BY THE THYMIC HORMONE THF-GAMMA-2, Experimental hematology, 21(2), 1993, pp. 277-282
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