AAAAAA
Results:
1-16
|
Results: 16
Authors:
MCCLUSKEY FP
HAKIM EB
FINK J
FOWLER A
PECHT MG
Citation: Fp. Mccluskey et al., RELIABILITY ASSESSMENT OF ELECTRONIC COMPONENTS EXPOSED TO LONG-TERM NON-OPERATING CONDITIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 352-359
Authors:
PECHT MG
Citation: Mg. Pecht, UNTITLED, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 373-374
Authors:
PECHT MG
Citation: Mg. Pecht, ELECTRONIC PACKAGING - CROSS-DISCIPLINE IS THE ONLY DISCIPLINE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(1), 1998, pp. 192-194
Authors:
DASGUPTA A
PECHT MG
MATHIEU B
Citation: A. Dasgupta et al., DESIGN-OF-EXPERIMENT METHODS FOR COMPUTATIONAL PARAMETRIC STUDIES IN ELECTRONIC PACKAGING, Finite elements in analysis and design, 30(1-2), 1998, pp. 125-146
Authors:
PECHT MG
SHUKLA AA
KELKAR N
PECHT J
Citation: Mg. Pecht et al., CRITERIA FOR THE ASSESSMENT OF RELIABILITY MODELS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 229-234
Authors:
PECHT MG
Citation: Mg. Pecht, WHAT DRIVES RESEARCH, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 541-541
Authors:
PECHT MG
Citation: Mg. Pecht, THE ELECTRONIC COMPONENTS OBSOLESCENCE PROBLEM, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(3), 1997, pp. 367-367
Authors:
CONDRA LW
ANISSIPOUR AA
MAYFIELD DD
PECHT MG
Citation: Lw. Condra et al., ELECTRONIC COMPONENTS OBSOLESCENCE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(3), 1997, pp. 368-371
Authors:
PECHT MG
Citation: Mg. Pecht, UNTITLED, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(2), 1997, pp. 251-251
Authors:
PECHT MG
Citation: Mg. Pecht, UNTITLED, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(1), 1997, pp. 83-83
Authors:
PECHT MG
FINK J
HAKIM E
WYLER J
Citation: Mg. Pecht et al., AN ASSESSMENT OF THE QUALIFIED MANUFACTURER LIST (QML), IEEE aerospace and electronic systems magazine, 12(7), 1997, pp. 39-43
Authors:
PECHT MG
Citation: Mg. Pecht, MILSPECS - TO BE OR NOT TO BE - OR WHY ATTEMPTING TO ACCOMPLISH CHANGE CAN FRUSTRATE THE MOST DETERMINED, IEEE transactions on reliability, 45(2), 1996, pp. 171-172
Authors:
OGUNJIMI AO
MACGREGOR S
PECHT MG
EVANS JW
Citation: Ao. Ogunjimi et al., THE EFFECT OF MANUFACTURING AND DESIGN PROCESS VARIABILITIES ON THE FATIGUE LIFE OF THE HIGH-DENSITY INTERCONNECT VIAS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(2), 1995, pp. 111-119
Authors:
PECHT MG
NASH FR
Citation: Mg. Pecht et Fr. Nash, PREDICTING THE RELIABILITY OF ELECTRONIC EQUIPMENT, Proceedings of the IEEE, 82(7), 1994, pp. 992-1004
Authors:
PECHT MG
SHE JY
BARBE DF
Citation: Mg. Pecht et al., EVALUATING TERMINAL PAIR SYSTEM RELIABILITY, IEICE transactions on fundamentals of electronics, communications and computer science, E76A(4), 1993, pp. 555-564
Authors:
PECHT MG
AGARWAL R
QUEARRY D
Citation: Mg. Pecht et al., PLASTIC PACKAGED MICROCIRCUITS - QUALITY, RELIABILITY, AND COST ISSUES, IEEE transactions on reliability, 42(4), 1993, pp. 513-517
Risultati:
1-16
|