Authors:
VIA D
BOZADA C
CERNY C
DESALVO G
DETTMER R
EBEL J
GILLESPIE J
JENKINS T
NAKANO K
PETTIFORD C
QUACH T
SEWELL J
Citation: D. Via et al., SAFE SOLVENT RESIST PROCESS FOR SUB-QUARTER MICRON T-GATES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(6), 1997, pp. 2916-2920
Authors:
QUACH T
JENKINS T
BARRETTE J
BOZADA C
CERNY C
DESALVO G
DETTMER R
EBEL J
GILLESPIE J
HAVASY C
ITO C
NAKANO K
PETTIFORD C
SEWELL J
VIA D
ANHOLT R
Citation: T. Quach et al., EMITTER UTILIZATION IN HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 41(9), 1997, pp. 1303-1308
Authors:
BOZADA C
CERNY C
DESALVO G
DETTMER R
EBEL J
GILLESPIE J
HAVASY C
JENKINS T
ITO C
NAKANO K
PETTIFORD C
QUACH T
SEWELL J
VIA GD
ANHOLT R
Citation: C. Bozada et al., THERMAL MANAGEMENT OF MICROWAVE-POWER HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 41(10), 1997, pp. 1667-1673
Authors:
JENKINS T
BOZADA C
DETTMER R
SEWELL J
VIA D
BARRETTE J
EBEL J
DESALVO G
HAVASY C
LIOU L
QUACH T
GILLESPIE J
PETTIFORD C
ITO C
NAKANO K
ANHOLT R
Citation: T. Jenkins et al., COMPARISON OF THERMAL-SHUNT AND FLIP-CHIP HBT THERMAL IMPEDANCES - COMMENT ON NOVEL HBT WITH REDUCED THERMAL IMPEDANCE, IEEE microwave and guided wave letters, 6(7), 1996, pp. 268-269