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Results:
1-20
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Results: 20
Authors:
Yim, MJ
Paik, KW
Citation: Mj. Yim et Kw. Paik, Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates, IEEE T COMP, 24(1), 2001, pp. 24-32
Authors:
Ko, HS
Chung, IS
Paik, KW
Citation: Hs. Ko et al., A study on the adhesion enhancement of polyetherimide to Si wafer using anAl-chelate treatment during multichip module fabrication, MAT SCI E B, 83(1-3), 2001, pp. 111-118
Authors:
Paik, KW
Citation: Kw. Paik, Low on power, WORLD TODAY, 57(2), 2001, pp. 22-24
Authors:
Ryu, W
Yim, MJ
Ahn, S
Lee, J
Kim, W
Paik, KW
Kim, J
Citation: W. Ryu et al., High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm, IEEE T COMP, 23(3), 2000, pp. 542-545
Authors:
Ko, HS
Kim, JS
Yoon, HG
Jang, SY
Cho, SD
Paik, KW
Citation: Hs. Ko et al., Development of three-dimensional memory die stack packages using polymer insulated sidewall technique, IEEE T AD P, 23(2), 2000, pp. 252-256
Authors:
Kim, JS
Paik, KW
Kim, BK
Lim, JH
Citation: Js. Kim et al., The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates, J MAT S-M E, 11(1), 2000, pp. 45-56
Authors:
Paik, KW
Yim, MJ
Jeon, YD
Citation: Kw. Paik et al., Flip chip assembly on organic boards using anisotropic conductive adhesives(ACAs) and nickel/gold bumps, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 378-384
Authors:
Yim, MJ
Ryu, W
Jeon, YD
Lee, J
Ahn, S
Kim, J
Paik, KW
Citation: Mj. Yim et al., Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications, IEEE T COMP, 22(4), 1999, pp. 575-581
Authors:
Kim, JS
Paik, KW
Seo, HS
Citation: Js. Kim et al., A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates, IEEE T AD P, 22(4), 1999, pp. 638-641
Authors:
Yim, MJ
Paik, KW
Citation: Mj. Yim et Kw. Paik, The contact resistance and reliability of anisotropically conductive film (ACF), IEEE T AD P, 22(2), 1999, pp. 166-173
Authors:
Cho, SD
Paik, KW
Citation: Sd. Cho et Kw. Paik, Study on the amorphous Ta2O5 thin film capacitors deposited by de magnetron reactive sputtering for multichip module applications, MAT SCI E B, 67(3), 1999, pp. 108-112
Authors:
Yim, MJ
Jeon, YD
Paik, KW
Ryu, W
Lee, J
Kim, J
Citation: Mj. Yim et al., Microwave modeling and characterization of anisotropic conductive adhesiveflip-chip interconnection, J KOR PHYS, 35, 1999, pp. S753-S758
Authors:
Ko, HS
Kim, JS
Yoon, HG
Paik, KW
Citation: Hs. Ko et al., Design of new 3-dimensional (3-D) die stack package and process optimization, J KOR PHYS, 35, 1999, pp. S759-S764
Authors:
Lee, JH
Park, LJ
Kim, SB
Paik, KW
Citation: Jh. Lee et al., The effect of reduction ratio of hot rolling on texture and secondary recrystallization of MA 754 plate, J MAT SCI L, 18(20), 1999, pp. 1645-1648
Authors:
Kim, KH
Park, JM
Kim, CK
Hofman, GL
Paik, KW
Citation: Kh. Kim et al., Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder, J NUCL MAT, 270(3), 1999, pp. 315-321
Authors:
Kim, JS
Paik, KW
Oh, SH
Citation: Js. Kim et al., The multilayer-modified Stoney's formula for laminated polymer composites on a silicon substrate, J APPL PHYS, 86(10), 1999, pp. 5474-5479
Authors:
Kim, JS
Paik, KW
Lim, JH
Earmme, YY
Citation: Js. Kim et al., Thermomechanical stress analysis of laminated thick-film multilayer substrates, APPL PHYS L, 74(23), 1999, pp. 3507-3509
Authors:
Jang, SY
Paik, KW
Citation: Sy. Jang et Kw. Paik, Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion, SOLDER S MT, 10(3), 1998, pp. 29
Authors:
Kim, JS
Paik, KW
Seo, HS
Oh, SH
Citation: Js. Kim et al., Biaxial stress analysis in laminated polymer films on silicon substrates for MCM-D application, J KOR PHYS, 33, 1998, pp. S142-S147
Authors:
Ko, HS
Paik, KW
Park, LJ
Kim, YG
Tundermann, JH
Citation: Hs. Ko et al., Influence of rhenium on the microstructures and mechanical properties of amechanically alloyed oxide dispersion-strengthened nickel-base superalloy, J MATER SCI, 33(13), 1998, pp. 3361-3370
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1-20
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