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Results:
1-7
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Results: 7
Authors:
Beverina, A
Bernard, H
Palleau, J
Torres, J
Tardif, F
Citation: A. Beverina et al., Copper photocorrosion phenomenon during post CMP cleaning, EL SOLID ST, 3(3), 2000, pp. 156-158
Authors:
Motte, P
Proust, M
Torres, J
Gobil, Y
Morand, Y
Palleau, J
Pantel, R
Juhel, M
Citation: P. Motte et al., TiN-CVD process optimization for integration with Cu-CVD, MICROEL ENG, 50(1-4), 2000, pp. 369-374
Authors:
Torres, J
Palleau, J
Tardiff, F
Bernard, H
Beverina, A
Motte, P
Pantel, R
Juhel, M
Citation: J. Torres et al., Overview of Cu contamination during integration in a dual damascene architecture for sub-quarter micron technology, MICROEL ENG, 50(1-4), 2000, pp. 425-431
Authors:
Motte, P
Torres, J
Palleau, J
Tardif, F
Demolliens, O
Bernard, H
Citation: P. Motte et al., Dielectric deposition process for Cu/SiO2 integration in a dual damascene interconnection architecture, MICROEL ENG, 50(1-4), 2000, pp. 487-493
Authors:
Motte, P
Torres, J
Palleau, J
Tardif, F
Bernard, H
Citation: P. Motte et al., Study of Cu contamination during copper integration for subquarter micron technology, SOL ST ELEC, 43(6), 1999, pp. 1015-1018
Authors:
Ikeda, S
Palleau, J
Torres, J
Chenevier, B
Bourhila, N
Madar, R
Citation: S. Ikeda et al., TEM studies of the microstructure evolution in plasma treated CVD TiN thinfilms used as diffusion barriers, SOL ST ELEC, 43(6), 1999, pp. 1063-1068
Authors:
Ikeda, S
Palleau, J
Torres, J
Chenevier, B
Bourhila, N
Madar, R
Citation: S. Ikeda et al., Film texture evolution in plasma treated TiN thin films, J APPL PHYS, 86(4), 1999, pp. 2300-2306
Risultati:
1-7
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