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Results:
1-12
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Results: 12
Authors:
Poppe, A
Farkas, G
Rencz, M
Benedek, Z
Pohl, L
Szekely, V
Torki, K
Mir, S
Courtois, B
Citation: A. Poppe et al., Design issues of a multi-functional intelligent thermal test die, P IEEE SEM, 2001, pp. 50-57
Authors:
Poppe, A
Holzwarth, R
Apolonski, A
Tempea, G
Spielmann, C
Hansch, TW
Krausz, F
Citation: A. Poppe et al., Few-cycle optical waveform synthesis (vol 72, pg 373, 2001), APP PHYS B, 72(8), 2001, pp. 977-977
Authors:
Poppe, A
Holzwarth, R
Apolonski, A
Tempea, G
Spielmann, C
Hansch, TW
Krausz, F
Citation: A. Poppe et al., Few-cycle optical waveform synthesis, APP PHYS B, 72(3), 2001, pp. 373-376
Authors:
Szekely, V
Rencz, M
Poppe, A
Courtois, B
Citation: V. Szekely et al., THERMODEL: A tool for thermal model generation, and application for MEMS, ANALOG IN C, 29(1-2), 2001, pp. 49-59
Authors:
Willner, L
Poppe, A
Allgaier, J
Monkenbusch, M
Richter, D
Citation: L. Willner et al., Time-resolved SANS for the determination of unimer exchange kinetics in block copolymer micelles, EUROPH LETT, 55(5), 2001, pp. 667-673
Authors:
Willner, L
Poppe, A
Allgaieri, J
Monkenbusch, M
Lindner, P
Richter, D
Citation: L. Willner et al., Micellization of amphiphilic diblock copolymers: Corona shape and mean-field to scaling crossover, EUROPH LETT, 51(6), 2000, pp. 628-634
Authors:
Apolonski, A
Poppe, A
Tempea, G
Spielmann, C
Udem, T
Holzwarth, R
Hansch, TW
Krausz, E
Citation: A. Apolonski et al., Controlling the phase evolution of few-cycle light pulses, PHYS REV L, 85(4), 2000, pp. 740-743
Authors:
Szekely, V
Poppe, A
Rencz, M
Rosental, M
Teszeri, T
Citation: V. Szekely et al., THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards, MICROEL REL, 40(3), 2000, pp. 517-524
Authors:
Szekely, V
Ress, S
Poppe, A
Torok, S
Magyari, D
Benedek, Z
Torki, K
Courtois, B
Rencz, M
Citation: V. Szekely et al., New approaches in the transient thermal measurements, MICROELEC J, 31(9-10), 2000, pp. 727-733
Authors:
Szekely, V
Rencz, M
Poppe, A
Courtois, B
Citation: V. Szekely et al., New hardware tools for the thermal transient testing of packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 46-52
Authors:
Szekely, V
Pahi, A
Poppe, A
Rencz, M
Citation: V. Szekely et al., Electro-thermal simulation with the SISSI package, ANALOG IN C, 21(1), 1999, pp. 21-31
Authors:
Nakano, M
Matsuoka, H
Yamaoka, H
Poppe, A
Richter, D
Citation: M. Nakano et al., Sphere to rod transition of micelles formed by amphiphilic diblock copolymers of vinyl ethers in aqueous solution, MACROMOLEC, 32(3), 1999, pp. 697-703
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