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Results: 1-15 |
Results: 15
MOLECULAR DYNAMIC SIMULATION OF ADHESIONAL RELEASE OF PARTICLES FROM SURFACES
Authors: QUESNEL DJ RIMAI DS DEMEJO LP
Citation: Dj. Quesnel et al., MOLECULAR DYNAMIC SIMULATION OF ADHESIONAL RELEASE OF PARTICLES FROM SURFACES, The Journal of adhesion, 67(1-4), 1998, pp. 235-257
STRESS DISTRIBUTIONS AT THE ABRASIVE-MATRIX INTERFACE DURING TOOL WEAR IN BOUND ABRASIVE GRINDING - A FINITE-ELEMENT ANALYSIS
Authors: ZHOU Y FUNKENBUSCH PD QUESNEL DJ
Citation: Y. Zhou et al., STRESS DISTRIBUTIONS AT THE ABRASIVE-MATRIX INTERFACE DURING TOOL WEAR IN BOUND ABRASIVE GRINDING - A FINITE-ELEMENT ANALYSIS, Wear, 209(1-2), 1997, pp. 247-254
FRIABILITY AND CRUSHING STRENGTH OF MICROMETER-SIZE DIAMOND ABRASIVESUSED IN MICROGRINDING OF OPTICAL-GLASS
Authors: ZHOU YY TAKAHASHI T QUESNEL DJ FUNKENBUSCH PD
Citation: Yy. Zhou et al., FRIABILITY AND CRUSHING STRENGTH OF MICROMETER-SIZE DIAMOND ABRASIVESUSED IN MICROGRINDING OF OPTICAL-GLASS, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 27(4), 1996, pp. 1047-1053
EFFECT OF SOLID-STATE INTERMETALLIC GROWTH ON THE FRACTURE-TOUGHNESS OF CU 63SN-37PB SOLDER JOINTS/
Authors: PRATT RE STROMSWOLD EI QUESNEL DJ
Citation: Re. Pratt et al., EFFECT OF SOLID-STATE INTERMETALLIC GROWTH ON THE FRACTURE-TOUGHNESS OF CU 63SN-37PB SOLDER JOINTS/, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 134-141
INTERACTION OF PROCESS VARIABLES WITH THE FRACTURE-BEHAVIOR OF AMORPHOUS POLYSTYRENE DURING ATTRITION
Authors: KUBISIAK MP QUESNEL DJ
Citation: Mp. Kubisiak et Dj. Quesnel, INTERACTION OF PROCESS VARIABLES WITH THE FRACTURE-BEHAVIOR OF AMORPHOUS POLYSTYRENE DURING ATTRITION, Polymer engineering and science, 36(17), 1996, pp. 2253-2259
MOLECULAR DYNAMIC MODELING OF INTERFACIAL ENERGY
Authors: QUESNEL DJ RIMAI DS DEMEJO LP
Citation: Dj. Quesnel et al., MOLECULAR DYNAMIC MODELING OF INTERFACIAL ENERGY, Journal of adhesion science and technology, 9(8), 1995, pp. 1015-1030
FRACTURE SURFACE INTERFERENCE EFFECTS IN MODE-III
Authors: REARDON AC QUESNEL DJ
Citation: Ac. Reardon et Dj. Quesnel, FRACTURE SURFACE INTERFERENCE EFFECTS IN MODE-III, Mechanics of materials, 19(2-3), 1995, pp. 213-226
MOLECULAR DYNAMIC MODELING OF PARTICLE ADHESION
Authors: QUESNEL DJ RIMAI DS DEMEJO LP
Citation: Dj. Quesnel et al., MOLECULAR DYNAMIC MODELING OF PARTICLE ADHESION, The Journal of adhesion, 51(1-4), 1995, pp. 49-69
MODE-I FRACTURE-TOUGHNESS TESTING OF EUTECTIC SN-PB SOLDER JOINTS
Authors: PRATT RE STROMSWOLD EI QUESNEL DJ
Citation: Re. Pratt et al., MODE-I FRACTURE-TOUGHNESS TESTING OF EUTECTIC SN-PB SOLDER JOINTS, Journal of electronic materials, 23(4), 1994, pp. 375-381
THE EFFECT OF SUBSTRATE SURFACE-ROUGHNESS ON THE FRACTURE-TOUGHNESS OF CU 96.5SN-3.5AG SOLDER JOINTS/
Authors: STROMSWOLD EI PRATT RE QUESNEL DJ
Citation: Ei. Stromswold et al., THE EFFECT OF SUBSTRATE SURFACE-ROUGHNESS ON THE FRACTURE-TOUGHNESS OF CU 96.5SN-3.5AG SOLDER JOINTS/, Journal of electronic materials, 23(10), 1994, pp. 1047-1053
THE EFFECT OF LOADING RATE ON CHEVRON-NOTCH FRACTURE-TOUGHNESS MEASUREMENTS
Authors: STROMSWOLD EI QUESNEL DJ
Citation: Ei. Stromswold et Dj. Quesnel, THE EFFECT OF LOADING RATE ON CHEVRON-NOTCH FRACTURE-TOUGHNESS MEASUREMENTS, Engineering fracture mechanics, 49(5), 1994, pp. 791-795
EFFECT OF ETCHING AND IMAGING MODE ON THE MEASUREMENT OF SUBSURFACE DAMAGE IN MICROGROUND OPTICAL-GLASSES
Authors: ZHOU YY FUNKENBUSCH PD QUESNEL DJ GOLINI D LINDQUIST A
Citation: Yy. Zhou et al., EFFECT OF ETCHING AND IMAGING MODE ON THE MEASUREMENT OF SUBSURFACE DAMAGE IN MICROGROUND OPTICAL-GLASSES, Journal of the American Ceramic Society, 77(12), 1994, pp. 3277-3280
ELASTIC COMPLIANCES AND STIFFNESSES OF THE FCC LENNARD-JONES SOLID
Authors: QUESNEL DJ RIMAI DS DEMEJO LP
Citation: Dj. Quesnel et al., ELASTIC COMPLIANCES AND STIFFNESSES OF THE FCC LENNARD-JONES SOLID, Physical review. B, Condensed matter, 48(10), 1993, pp. 6795-6807
CAPILLARY SOLDERING SYSTEM FOR THE MATERIAL PROPERTY CHARACTERIZATIONOF SOLDER JOINTS
Authors: STROMSWOLD EI PRATT RE QUESNEL DJ
Citation: Ei. Stromswold et al., CAPILLARY SOLDERING SYSTEM FOR THE MATERIAL PROPERTY CHARACTERIZATIONOF SOLDER JOINTS, Review of scientific instruments, 64(11), 1993, pp. 3314-3320
AN ENGINEERING TOOL FOR FRACTURE-TOUGHNESS TESTING - REPLY
Authors: STROMSWOLD EI QUESNEL DJ
Citation: Ei. Stromswold et Dj. Quesnel, AN ENGINEERING TOOL FOR FRACTURE-TOUGHNESS TESTING - REPLY, Engineering fracture mechanics, 46(4), 1993, pp. 723-723
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