Authors: Rossnagel, SM Sherman, A Turner, F

Citation: Sm. Rossnagel et al., Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers, J VAC SCI B, 18(4), 2000, pp. 2016-2020

Authors: Saenger, KL Cabral, C Lavoie, C Rossnagel, SM

Citation: Kl. Saenger et al., Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering, J APPL PHYS, 86(11), 1999, pp. 6084-6087

Authors: Rossnagel, SM

Citation: Sm. Rossnagel, Sputter deposition for semiconductor manufacturing, IBM J RES, 43(1-2), 1999, pp. 163-179

Authors: Rossnagel, SM

Citation: Sm. Rossnagel, Interaction between gas rarefaction and metal ionization in ionized physical vapor deposition, J VAC SCI B, 16(6), 1998, pp. 3008-3012

Authors: Hsu, Y Standaert, TEFM Oehrlein, GS Kuan, TS Sayre, E Rose, K Lee, KY Rossnagel, SM

Citation: Y. Hsu et al., Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching, J VAC SCI B, 16(6), 1998, pp. 3344-3348