Authors:
DALRYMPLE BJ
LEUNG M
SANDELL RD
SPARGO JW
PHAM T
SPOONER A
Citation: Bj. Dalrymple et al., MULTI-GB S OPERATION OF FLIPPED CHIP MVTL CIRCUITS/, IEEE transactions on applied superconductivity, 7(2), 1997, pp. 2693-2696
Citation: Rd. Sandell et al., MULTICHIP PACKAGING FOR HIGH-SPEED SUPERCONDUCTING CIRCUITS, IEEE transactions on applied superconductivity, 5(2), 1995, pp. 3160-3163