Citation: Mk. Hirschfeld et al., CORROSION PROPERTIES OF TITANIUM-BASED HARD COATINGS ON STEEL, Materialwissenschaft und Werkstofftechnik, 29(9), 1998, pp. 484-495
Citation: T. Reier et al., NUCLEATION AND GROWTH OF ALN NANOCRYSTALLITES PREPARED BY N-2(+) IMPLANTATION, Surface & coatings technology, 104, 1998, pp. 415-420
Authors:
OSTERLE W
DORFEL I
URBAN I
REIER T
SCHULTZE JW
Citation: W. Osterle et al., XPS AND XTEM STUDY OF A1N FORMATION BY N-2(+) IMPLANTATION OF ALUMINUM, Surface & coatings technology, 102(1-2), 1998, pp. 168-174
Citation: Jw. Schultze et M. Schweinsberg, FROM PM TO KM - SCALING-UP AND SCALING DOWN OF ELECTROCHEMICAL SYSTEMS WITH TIO2 AND ZRO2 PASSIVE FILMS AS AN EXAMPLE, Electrochimica acta, 43(19-20), 1998, pp. 2761-2772
Citation: A. Michaelis et al., EFFECT OF GAMMA-RADIATION ON THE PASSIVE LAYERS OF TI AND TI0.2PD CONTAINER-MATERIALS FOR HIGH-LEVEL WASTE-DISPOSAL, Electrochimica acta, 43(1-2), 1998, pp. 119-130
Citation: M. Kupper et Jw. Schultze, A NEW COPPER-ION SELECTIVE MICROELECTRODE FOR ELECTROCHEMICAL APPLICATIONS, Journal of electroanalytical chemistry [1992], 427(1-2), 1997, pp. 129-135
Citation: M. Kupper et Jw. Schultze, SPATIALLY-RESOLVED CONCENTRATION MEASUREMENTS DURING CATHODIC ALLOY DEPOSITION IN MICROSTRUCTURES, Electrochimica acta, 42(20-22), 1997, pp. 3023-3031
Citation: T. Morgenstern et Jw. Schultze, LASER DEPOSITION OF METALS AND POLYMERS IN SI-MICROSTRUCTURES, Electrochimica acta, 42(20-22), 1997, pp. 3057-3064
Citation: M. Kupper et Jw. Schultze, SLCP - THE SCANNING DIFFUSION-LIMITED CURRENT PROBE - A NEW METHOD FOR SPATIALLY-RESOLVED ANALYSIS, Electrochimica acta, 42(20-22), 1997, pp. 3085-3094
Citation: E. Klusmann et Jw. Schultze, PH-MICROSCOPY - THEORETICAL AND EXPERIMENTAL INVESTIGATIONS, Electrochimica acta, 42(20-22), 1997, pp. 3123-3134
Authors:
SCHONING MJ
RONKEL F
CROTT M
THUST M
SCHULTZE JW
KORDOS P
LUTH H
Citation: Mj. Schoning et al., MINIATURIZATION OF POTENTIOMETRIC SENSORS USING POROUS SILICON MICROTECHNOLOGY, Electrochimica acta, 42(20-22), 1997, pp. 3185-3193
Citation: M. Schweinsberg et al., GROWTH OF ORIENTED ANODIC FILMS ON SINGLE GRAINS OF ZR - STRUCTURE AND EPITAXY FROM ANISOTROPY-MICRO-ELLIPSOMETRY, Electrochimica acta, 42(20-22), 1997, pp. 3303-3310
Citation: S. Kudelka et Jw. Schultze, PHOTOELECTROCHEMICAL IMAGING AND MICROSCOPIC REACTIVITY OF OXIDIZED TI, Electrochimica acta, 42(18), 1997, pp. 2817-2825
Citation: Jw. Schultze et D. Rolle, THE PARTIAL DISCHARGE OF ELECTROSORBATES AND ITS INFLUENCE IN ELECTROCATALYSIS, Canadian journal of chemistry, 75(11), 1997, pp. 1750-1758
Citation: Haa. Elrahman et Jw. Schultze, NEW QUATERNIZED AMINOQUINOLINE POLYMER-FILMS - ELECTROPOLYMERIZATION AND CHARACTERIZATION, Journal of electroanalytical chemistry [1992], 416(1-2), 1996, pp. 67-74
Authors:
BAUMGARTEN E
FIEBES A
STUMPE A
RONKEL F
SCHULTZE JW
Citation: E. Baumgarten et al., SYNTHESIS AND CHARACTERIZATION OF A NEW PLATINUM SUPPORTED CATALYST BASED ON 3-(ACRYLOYLAMINO)PROPYLTRIMETHYLAMMONIUMCHLORIDE]) AS CARRIER, Journal of molecular catalysis. A, Chemical, 113(3), 1996, pp. 469-477
Authors:
TREFZ J
SCHWEINSBERG M
REIER T
SCHULTZE JW
Citation: J. Trefz et al., SYSTEMATIC INVESTIGATION ON THE CORROSION OF IRON UNDER CONDITIONS RELEVANT TO STORAGE OF NUCLEAR WASTE, Werkstoffe und Korrosion, 47(9), 1996, pp. 475-485
Citation: A. Thies et Jw. Schultze, CORROSION AND PASSIVITY OF HASTELLOY C4 IN A HIGH SALINITY BRINE, Werkstoffe und Korrosion, 47(3), 1996, pp. 146-153
Citation: M. Kupper et Jw. Schultze, MICROGALVANICS - LOCALLY RESOLVED CONCENTRATION MEASUREMENTS WITH ION-SELECTIVE MICROELECTRODES AND CHRONOAMPEROMETRIC MICROELECTRODES, Fresenius' journal of analytical chemistry, 356(3-4), 1996, pp. 187-191
Citation: S. Simson et al., ELECTROCHEMICAL AND SURFACE ANALYTICAL CHARACTERIZATION OF RADIATION EFFECTS AFTER N-2(+) IMPLANTATION INTO AL AND AL2O3, Surface & coatings technology, 83(1-3), 1996, pp. 49-54
Citation: A. Michaelis et Jw. Schultze, PHOTOCURRENT MEASUREMENTS ON THIN PASSIVE FILMS AT HIGH LOCAL RESOLUTION, Applied surface science, 106, 1996, pp. 483-490