Authors: ZHAO B BIBERGER MA HOFFMAN V WANG SQ VASUDEV PK SEIDEL TE

Citation: B. Zhao et al., A NOVEL SUBHALF MICRON AL-CU VIA PLUG INTERCONNECT USING LOW DIELECTRIC-CONSTANT MATERIAL AS INTER-LEVEL DIELECTRIC, IEEE electron device letters, 18(2), 1997, pp. 57-59

Authors: ZHAO B BIBERGER MA HOFFMAN V WANG SQ VASUDEV PK SEIDEL TE

Citation: B. Zhao et al., LOW-TEMPERATURE AND LOW-COST PLANARISED ALUMINUM INTERCONNECT FOR SUBHALF MICROMETER VLSI CIRCUITS, Electronics Letters, 33(3), 1997, pp. 247-248

Authors: BORLAND JO SEIDEL TE

Citation: Jo. Borland et Te. Seidel, EPI REPLACEMENT IN MANUFACTURING USING MEV IMPLANTATION, Solid state technology, 39(6), 1996, pp. 89

Authors: VASUDEV PK MENDICINO M SEIDEL TE

Citation: Pk. Vasudev et al., ADVANCED MATERIALS FOR LOW-POWER ELECTRONICS, Solid-state electronics, 39(4), 1996, pp. 489-497

Authors: LI J SEIDEL TE MAYER JW

Citation: J. Li et al., COPPER-BASED METALLIZATION IN ULSI STRUCTURES .2. IS CU AHEAD OF ITS TIME AS AN ON-CHIP INTERCONNECT MATERIAL, MRS bulletin, 19(8), 1994, pp. 15-18