Authors: OFLAHERTY M CAHILL C RODGERS K SLATTERY O

Citation: M. Oflaherty et al., THERMAL-RESISTANCE MEASUREMENT PROTOCOLS, Microelectronics, 29(4-5), 1998, pp. 199-208

Authors: OFLAHERTY M CAHILL C RODGERS K SLATTERY O

Citation: M. Oflaherty et al., VALIDATION OF NUMERICAL-MODELS OF CERAMIC PIN GRID ARRAY PACKAGES, Microelectronics, 28(3), 1997, pp. 229-238

Authors: CAHILL C COMPAGNO A ODONOVAN J SLATTERY O OMATHUNA SC BARRETT J SERTHELON I VAL C TIGNERES JP STERN J IVEY P MASGRANGEAS M COELLOVERA A

Citation: C. Cahill et al., THERMAL CHARACTERIZATION OF VERTICAL MULTICHIP MODULES MCM-V, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 765-772

Authors: SLATTERY O HAYES T LAWTON W KELLY G LYDEN C BARRETT J OMATHUNA C

Citation: O. Slattery et al., METHODS OF ANALYZING THERMOMECHANICAL STRESS IN PLASTIC PACKAGES FOR INTEGRATED-CIRCUITS, Journal of materials processing technology, 54(1-4), 1995, pp. 199-204