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Results: 1-25/35
Authors:
Kim, HK
Shi, FG
Citation: Hk. Kim et Fg. Shi, Thickness dependent dielectric strength of a low-permittivity dielectric film, IEEE DIELEC, 8(2), 2001, pp. 248-252
Authors:
Kim, HK
Shi, FG
Citation: Hk. Kim et Fg. Shi, Refractive index of polycrystalline submicrometer polymer thin films: Thickness dependence, J MAT S-M E, 12(7), 2001, pp. 361-364
Authors:
Shi, FG
Zhao, B
Citation: Fg. Shi et B. Zhao, Special Issue on Advances in Materials Science of IC Interconnects and Packaging - Foreword, J ELEC MAT, 30(4), 2001, pp. 283-283
Authors:
Mikrajuddin,"Shi, FG
Okuyama, K
Citation: Fg. Mikrajuddin,"shi et K. Okuyama, Temperature-dependent electrical conduction in porous silicon: Non-Arrhenius behavior, EUROPH LETT, 54(2), 2001, pp. 234-240
Authors:
Shi, FG
Citation: Fg. Shi, Pointwise pseudo-metrics in L-fuzzy set theory, FUZ SET SYS, 121(2), 2001, pp. 209-216
Authors:
Shi, FG
Citation: Fg. Shi, A note on the compactness in L-fuzzy topological spaces, FUZ SET SYS, 119(3), 2001, pp. 547-548
Authors:
Mondal, SK
Shi, FG
Citation: Sk. Mondal et Fg. Shi, Novel lensed-fiber offset coupling scheme to reduce reflected intensity noise in optimizing carrier-to-noise ratio, OPT COMMUN, 199(5-6), 2001, pp. 399-405
Authors:
Tang, Z
Zhang, R
Mondal, SK
Shi, FG
Citation: Z. Tang et al., Optimization of fiber-optic coupling and alignment tolerance for coupling between a laser diode and a wedged single-mode fiber, OPT COMMUN, 199(1-4), 2001, pp. 95-101
Authors:
Tang, Z
Zhang, R
Shi, FG
Citation: Z. Tang et al., Effects of angular misalignments on fiber-optic alignment automation, OPT COMMUN, 196(1-6), 2001, pp. 173-180
Authors:
Tang, ZR
Shi, FG
Citation: Zr. Tang et Fg. Shi, Effects of preexisting voids on electromigration failure of flip chip solder bumps, MICROELEC J, 32(7), 2001, pp. 605-613
Authors:
Kim, HK
Shi, FG
Citation: Hk. Kim et Fg. Shi, Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density, MICROELEC J, 32(4), 2001, pp. 315-321
Authors:
Vo, HT
Todd, M
Shi, FG
Shapiro, AA
Edwards, M
Citation: Ht. Vo et al., Towards model-based engineering of underfill materials: CTE modeling, MICROELEC J, 32(4), 2001, pp. 331-338
Authors:
Kim, HK
Shi, FG
Citation: Hk. Kim et Fg. Shi, Thickness-dependent thermal reliability of low-dielectric constant polycrystalline PTFE submicron dielectric thin films, MICROELEC J, 32(3), 2001, pp. 215-219
Authors:
Tang, Z
Shi, FG
Citation: Z. Tang et Fg. Shi, Stochastic simulation of electromigration failure of flip chip solder bumps, MICROELEC J, 32(1), 2001, pp. 53-60
Authors:
Mikrajuddin,"Iskandar, F
Okuyama, K
Shi, FG
Citation: F. Mikrajuddin,"iskandar et al., Stable photoluminescence of zinc oxide quantum dots in silica nanoparticles matrix prepared by the combined sol-gel and spray drying method, J APPL PHYS, 89(11), 2001, pp. 6431-6434
Authors:
Shi, FG
Nieh, TG
Chou, YT
Citation: Fg. Shi et al., A free volume approach for self-diffusion in metals, SCR MATER, 43(3), 2000, pp. 265-267
Authors:
Wang, J
Shi, FG
Nieh, TG
Zhao, B
Brongo, MR
Qu, S
Rosenmayer, T
Citation: J. Wang et al., Thickness dependence of elastic modulus and hardness of on-wafer low-k ultrathin polytetrafluoroethylene films, SCR MATER, 42(7), 2000, pp. 687-694
Authors:
Mikrajuddin,"Okuyama, K
Shi, FG
Citation: K. Mikrajuddin,"okuyama et Fg. Shi, Mechanical effect on the electronic properties of molecular wires, PHYS REV B, 61(12), 2000, pp. 8224-8232
Thickness dependence of morphology and mechanical properties of on-wafer low-k PTFE dielectric films
Authors:
Wang, JG
Kim, HK
Shi, FG
Zhao, B
Nieh, TG
Citation: Jg. Wang et al., Thickness dependence of morphology and mechanical properties of on-wafer low-k PTFE dielectric films, THIN SOL FI, 377, 2000, pp. 413-417
Authors:
Mikrajuddin,"Shi, FG
Nieh, TG
Okuyama, K
Citation: Fg. Mikrajuddin,"shi et al., Metal-to-semiconductor transition in nanocrystals: size and temperature dependence, MICROELEC J, 31(5), 2000, pp. 343-351
Authors:
Mikrajuddin,"Shi, FG
Nieh, TG
Okuyama, K
Citation: Fg. Mikrajuddin,"shi et al., Electrical conduction in solid polymer electrolytes: temperature dependence mechanism, MICROELEC J, 31(4), 2000, pp. 261-265
Authors:
Hsu, DT
Kim, HK
Shi, FG
Tong, HY
Chungpaiboonpatana, S
Davidson, C
Adams, JM
Citation: Dt. Hsu et al., Curing kinetics and optimal cure schedules for underfill materials, MICROELEC J, 31(4), 2000, pp. 271-275
Authors:
Mikrajuddin,"Shi, FG
Okuyama, K
Citation: Fg. Mikrajuddin,"shi et K. Okuyama, Electrical conduction in porous silicon: temperature dependence, MICROELEC J, 31(3), 2000, pp. 187-191
Authors:
Mikrajuddin,"Shi, FG
Okuyama, K
Citation: Fg. Mikrajuddin,"shi et K. Okuyama, Electrical conduction in insulator particle-solid-state ionic and conducting particle-insulator matrix composites - A unified theory, J ELCHEM SO, 147(8), 2000, pp. 3157-3165
Authors:
Fujimoto, T
Itoh, Y
Okuyama, K
Yamada, S
Murakami, T
Shi, FG
Citation: T. Fujimoto et al., Chemical reaction kinetics and growth rate of (Ba, Sr) TiO3 films preparedby liquid source chemical vapor deposition, J ELCHEM SO, 147(7), 2000, pp. 2581-2588