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Results:
1-8
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Results: 8
Authors:
GREGUS JA
LAU MY
DEGANI Y
TAI KL
Citation: Ja. Gregus et al., CHIP-SCALE MODULES FOR HIGH-LEVEL INTEGRATION IN THE 21ST-CENTURY, Bell Labs technical journal, 3(3), 1998, pp. 116-124
Authors:
ZHAO JS
FRYE RC
DAI WWM
TAI KL
Citation: Js. Zhao et al., S-PARAMETER-BASED EXPERIMENTAL MODELING OF HIGH-Q-MCM INDUCTOR WITH EXPONENTIAL GRADIENT LEARNING ALGORITHM, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 202-210
Authors:
ZU L
LU YC
FRYE RC
LAU MY
CHEN SCS
KOSSIVES DP
LIN JS
TAI KL
Citation: L. Zu et al., HIGH Q-FACTOR INDUCTORS INTEGRATED ON MCM SI SUBSTRATES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 635-643
Authors:
FRYE RC
TAI KL
Citation: Rc. Frye et Kl. Tai, SILICON MULTICHIP MODULES - EVOLVING A HIGH-PERFORMANCE TECHNOLOGY FROM LOW-END APPLICATIONS, Materials chemistry and physics, 40(4), 1995, pp. 230-235
Authors:
CHEN HS
BACON DD
CHEN CH
KAMMLOTT G
JENG GK
WERDER DJ
TAI KL
Citation: Hs. Chen et al., SIMPLE NB METAL-BONDING STRUCTURE, Applied physics letters, 66(17), 1995, pp. 2191-2193
Authors:
LEE CH
TAI KL
BACON DD
DOHERTY C
KATZ A
WONG YM
LANE E
Citation: Ch. Lee et al., BONDING OF INP LASER-DIODES BY AU-SN SOLDER AND TUNGSTEN-BASED BARRIER METALLIZATION SCHEMES, Semiconductor science and technology, 9(4), 1994, pp. 379-386
Authors:
KATZ A
LEE CH
TAI KL
Citation: A. Katz et al., ADVANCED METALLIZATION SCHEMES FOR BONDING OF INP-BASED LASER DEVICESTO CVD-DIAMOND HEATSINKS, Materials chemistry and physics, 37(4), 1994, pp. 303-328
Authors:
FRYE RC
TAI KL
LAU MY
GABARA TJ
Citation: Rc. Frye et al., TRENDS IN SILICON-ON-SILICON MULTICHIP MODULES, IEEE design & test of computers, 10(4), 1993, pp. 8-17
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1-8
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