Authors: TZENG GS CHEN HJ WANG YY WAN CC

Citation: Gs. Tzeng et al., DIRECT METALLIZATION OF TEFLON-BASED PRINTED-CIRCUIT BOARDS, Surface & coatings technology, 90(1-2), 1997, pp. 71-74

Authors: TZENG GS CHEN HJ WANG YY WAN CC

Citation: Gs. Tzeng et al., THE EFFECTS OF ROUGHENING ON TEFLON SURFACES, Surface & coatings technology, 89(1-2), 1997, pp. 108-113

Authors: TZENG GS JANG SC WANG YY WAN CC

Citation: Gs. Tzeng et al., STUDY THE ETCHING MECHANISM OF PHOTOSENSITIVE DRY FILM ON DEPOSITING GOLD DURING FABRICATION OF PRINTED-CIRCUIT BOARD, Materials chemistry and physics, 51(1), 1997, pp. 70-74

Authors: TZENG GS

Citation: Gs. Tzeng, EFFECT OF HALIDE-IONS ON ELECTROLESS NICKEL-PLATING, Journal of Applied Electrochemistry, 26(9), 1996, pp. 969-975

Authors: TZENG GS LIN SH WANG YY WAN CC

Citation: Gs. Tzeng et al., EFFECTS OF ADDITIVES ON THE ELECTRODEPOSITION OF TIN FROM AN ACIDIC SN(II) BATH, Journal of Applied Electrochemistry, 26(4), 1996, pp. 419-423

Authors: TZENG GS

Citation: Gs. Tzeng, EFFECTS OF ADDITIVE AGENTS ON THE KINETICS OF TIN ELECTRODEPOSITION FROM AN ACIDIC SOLUTION OF TIN(II) SULFATE, Plating and surface finishing, 82(11), 1995, pp. 67-71