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Results:
1-7
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Results: 7
Authors:
Forthoffer, N
Helvig, C
Dillon, N
Benveniste, I
Zimmerlin, A
Tardif, F
Salaun, JP
Citation: N. Forthoffer et al., Induction and inactivation of a cytochrome P450 confering herbicide resistance in wheat seedlings, EUR J DRUG, 26(1-2), 2001, pp. 9-16
Authors:
Beverina, A
Bernard, H
Palleau, J
Torres, J
Tardif, F
Citation: A. Beverina et al., Copper photocorrosion phenomenon during post CMP cleaning, EL SOLID ST, 3(3), 2000, pp. 156-158
Authors:
Constant, I
Tardif, F
Derrien, J
Citation: I. Constant et al., Deposition and removal of sodium contamination on silicon wafers, SEMIC SCI T, 15(1), 2000, pp. 61-66
Authors:
Palun, L
Tedesco, S
Heitzman, M
Martin, F
Fraboulet, D
Dal'zotto, B
Nier, ME
Mur, P
Charvolin, T
Mariolle, D
Tardif, F
Citation: L. Palun et al., Fabrication of single electron devices by hybrid (E-beam/DUV) lithography, MICROEL ENG, 53(1-4), 2000, pp. 167-170
Authors:
Motte, P
Torres, J
Palleau, J
Tardif, F
Demolliens, O
Bernard, H
Citation: P. Motte et al., Dielectric deposition process for Cu/SiO2 integration in a dual damascene interconnection architecture, MICROEL ENG, 50(1-4), 2000, pp. 487-493
Authors:
Danel, A
Tardif, F
Kamarinos, G
Citation: A. Danel et al., Surface dopant concentration measurement using the Surface Charge Profiler(SCP) method: characterization of hydrogen and metallic contamination in silicon, MAT SCI E B, 58(1-2), 1999, pp. 64-70
Authors:
Motte, P
Torres, J
Palleau, J
Tardif, F
Bernard, H
Citation: P. Motte et al., Study of Cu contamination during copper integration for subquarter micron technology, SOL ST ELEC, 43(6), 1999, pp. 1015-1018
Risultati:
1-7
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