Authors:
Ehrmann, A
Struck, T
Chalupka, A
Haugeneder, E
Loschner, H
Butschke, J
Irmscher, M
Letzkus, F
Springer, R
Degen, A
Rangelow, IW
Shi, F
Sossna, E
Volland, B
Engelstad, R
Lovell, E
Tejeda, R
Citation: A. Ehrmann et al., Comparison of silicon stencil mask distortion measurements with finite element analysis, J VAC SCI B, 17(6), 1999, pp. 3107-3111
Authors:
Engelstad, R
Lovell, E
Dicks, G
Fisher, A
Tejeda, R
Citation: R. Engelstad et al., Modeling and simulation of membrane distortions in Next Generation Lithography (NGL) masks, MICROEL ENG, 46(1-4), 1999, pp. 23-26
Authors:
Rangelow, IW
Shi, F
Volland, B
Sossna, E
Petrashenko, A
Hudek, P
Sunyk, R
Butschke, J
Letzkus, F
Springer, R
Ehrmann, A
Gross, G
Kaesmaier, R
Oelmann, A
Struck, T
Unger, G
Chalupka, A
Haugeneder, E
Lammer, G
Loschner, H
Tejeda, R
Lovell, E
Engelstad, R
Citation: Iw. Rangelow et al., p-n junction-based wafer flow process for stencil mask fabrication, J VAC SCI B, 16(6), 1998, pp. 3592-3598