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Results:
1-8
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Results: 8
Authors:
Bhattacharya, SK
Tummala, RR
Citation: Sk. Bhattacharya et Rr. Tummala, Integral passives for next generation of electronic packaging: applicationof epoxy/ceramic nanocomposites as integral capacitors, MICROELEC J, 32(1), 2001, pp. 11-19
Authors:
Bhattacharya, SK
Gardner, BM
Qu, J
Baldwin, DF
Tummala, RR
Citation: Sk. Bhattacharya et al., Low-cost large area processing using small area substrates - A novel multitiled palletization concept for MCM-D thin film process, IEEE T AD P, 23(4), 2000, pp. 661-671
Authors:
Misman, O
Bhattacharya, SK
Erbil, A
Tummala, RR
Citation: O. Misman et al., PWB compatible high value integral capacitors by MOCVD, J MAT S-M E, 11(9), 2000, pp. 657-660
Authors:
Bhattacharya, SK
Park, JY
Tummala, RR
Allen, MG
Citation: Sk. Bhattacharya et al., Fabrication of a fully integrated passive module for filter application using MCM-D compatible processes, J MAT S-M E, 11(6), 2000, pp. 455-460
Authors:
Bhattacharya, SK
Tummala, RR
Citation: Sk. Bhattacharya et Rr. Tummala, Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates, J MAT S-M E, 11(3), 2000, pp. 253-268
Authors:
Tummala, RR
Wong, CP
Chan, YC
Citation: Rr. Tummala et al., Microelectronic packaging and assembly roadmap for Hong Kong and Pearl River Delta region: A team study and recommendations, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 21-23
Authors:
Tummala, RR
Madisetti, VK
Citation: Rr. Tummala et Vk. Madisetti, System on chip or system on package?, IEEE DES T, 16(2), 1999, pp. 48-56
Authors:
Tummala, RR
Citation: Rr. Tummala, Electronic packaging research and education: A model for the 21st century, J H APL TEC, 20(1), 1999, pp. 111-121
Risultati:
1-8
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