Authors:
VANOLMEN J
MANCA JV
DECEUNINCK W
DESCHEPPER L
DHAEGER V
WITVROUW A
MAEX K
Citation: J. Vanolmen et al., OVERVIEW OF THE KINETICS OF THE EARLY STAGES OF ELECTROMIGRATION UNDER LOW (= REALISTIC) CURRENT-DENSITY STRESS, Microelectronics and reliability, 38(6-8), 1998, pp. 1009-1013
Authors:
DECEUNINCK WA
DHAEGER V
VANOLMEN J
WITVROUW A
MAEX K
DESCHEPPER L
DEPAUW P
PERGOOT A
Citation: Wa. Deceuninck et al., THE INFLUENCE OF ADDITION ELEMENTS ON THE EARLY RESISTANCE CHANGES OBSERVED DURING ELECTROMIGRATION TESTING OF AL METAL LINES, Microelectronics and reliability, 38(1), 1998, pp. 87-98
Authors:
DECEUNINCK W
MANCA J
DHAEGER V
VANOLMEN J
DESCHEPPER L
STALS LM
Citation: W. Deceuninck et al., DESIGN OF A NEW TEST STRUCTURE FOR THE STUDY OF ELECTROMIGRATION WITHEARLY RESISTANCE CHANGE MEASUREMENTS, Microelectronics and reliability, 37(12), 1997, pp. 1813-1816
Authors:
VANOLMEN J
DECEUNINCK W
DESCHEPPER L
GOLDONI A
CERVINI A
FANTINI F
Citation: J. Vanolmen et al., THE THERMALLY BALANCED BRIDGE TECHNIQUE (TBBT) - A NEW HIGH-RESOLUTION RESISTOMETRIC MEASUREMENT TECHNIQUE FOR THE STUDY OF ELECTROMIGRATION-INDUCED EARLY RESISTANCE CHANGES IN METAL STRIPES, Microelectronics and reliability, 37(10-11), 1997, pp. 1483-1486