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Results: 1-11 |
Results: 11

Authors: Wang, SB Wendt, AE
Citation: Sb. Wang et Ae. Wendt, Ion bombardment energy and SiO2/Si fluorocarbon plasma etch selectivity, J VAC SCI A, 19(5), 2001, pp. 2425-2432

Authors: Wendt, AE
Citation: Ae. Wendt, Passive external radio frequency filter for Langmuir probes, REV SCI INS, 72(7), 2001, pp. 2926-2930

Authors: Andrew, Y Booske, JH Lu, S Snodgrass, TG Wendt, AE
Citation: Y. Andrew et al., Reduction of effects of rarefaction in ionized physical vapour deposition discharges, PLASMA SOUR, 9(4), 2000, pp. 562-567

Authors: Andrew, Y Lu, Z Snodgrass, T Teitzel, G Wendt, AE
Citation: Y. Andrew et al., Interactions between plasmas in ionized physical vapor deposition discharges, J VAC SCI A, 18(5), 2000, pp. 2137-2142

Authors: Andrew, Y Abraham, I Booske, JH Lu, ZC Wendt, AE
Citation: Y. Andrew et al., Absolute densities of long lived species in an ionized physical vapor deposition copper-argon plasma, J APPL PHYS, 88(6), 2000, pp. 3208-3219

Authors: Wang, SB Wendt, AE
Citation: Sb. Wang et Ae. Wendt, Control of ion energy distribution at substrates during plasma processing, J APPL PHYS, 88(2), 2000, pp. 643-646

Authors: Lu, ZC Foster, JE Snodgrass, TG Booske, JH Wendt, AE
Citation: Zc. Lu et al., Measurement of electron energy distribution function in an argon copper plasma for ionized physical vapor deposition, J VAC SCI A, 17(3), 1999, pp. 840-844

Authors: Foster, JE Wendt, AE Wang, WW Booske, JH
Citation: Je. Foster et al., Determination of metal vapor ion concentration in an argon/copper plasma for ionized physical vapor deposition (vol A16, pg 2198, 1998), J VAC SCI A, 17(1), 1999, pp. 322-322

Authors: Wang, SB Wendt, AE
Citation: Sb. Wang et Ae. Wendt, Sheath thickness evaluation for collisionless or weakly collisional bounded plasmas, IEEE PLAS S, 27(5), 1999, pp. 1358-1365

Authors: Snodgrass, TG Booske, JH Wang, W Wendt, AE Shohet, JL
Citation: Tg. Snodgrass et al., Gridless ionized metal flux fraction measurement tool for use in ionized physical vapor deposition studies, REV SCI INS, 70(2), 1999, pp. 1525-1529

Authors: Wang, W Foster, J Snodgrass, T Wendt, AE Booske, JH
Citation: W. Wang et al., An rf sustained argon and copper plasma for ionized physical vapor deposition of copper, J APPL PHYS, 85(11), 1999, pp. 7556-7561
Risultati: 1-11 |