Authors: Xiao, ZX Wu, XT Peng, WY Farmer, KR

Citation: Zx. Xiao et al., An angle-based design approach for rectangular electrostatic torsion actuators, J MICROEL S, 10(4), 2001, pp. 561-568

Authors: Li, ZH Yang, ZC Xiao, ZX Hao, YL Li, T Wu, GY Wang, YY

Citation: Zh. Li et al., A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching, SENS ACTU-A, 83(1-3), 2000, pp. 24-29

Authors: Xiao, ZX Hao, YL Li, T Zhang, GB Liu, SM Wu, GY

Citation: Zx. Xiao et al., A new release process for polysilicon surface micromachining using sacrificial polysilicon anchor and photolithography after sacrificial etching, J MICROM M, 9(4), 1999, pp. 300-304

Authors: Xiao, ZX Hao, YL Zhang, GB Wu, GY Li, ZH Chen, WR Liu, SM Li, T Wang, TS Wang, YY

Citation: Zx. Xiao et al., A new process for releasing micromechanical structures in surface micromachining with polysilicon support and LPCVD Si3N4 embedded mask, SENS ACTU-A, 72(2), 1999, pp. 189-194

Authors: Xiao, ZX Wu, GY Li, ZH Zhang, CB Hao, YL Wang, YY

Citation: Zx. Xiao et al., Silicon-glass wafer bonding with silicon hydrophilic fusion bonding technology, SENS ACTU-A, 72(1), 1999, pp. 46-48