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Results: 1-25/66
Authors:
MOYER LK
GUPTA SM
Citation: Lk. Moyer et Sm. Gupta, ENVIRONMENTAL CONCERNS AND RECYCLING DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY/, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 1-22
Authors:
NGOI BKA
LIM LEN
EE JT
Citation: Bka. Ngoi et al., ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 23-27
Authors:
NATISHAN ME
POWELL JC
BEATTY KE
Citation: Me. Natishan et al., IN-SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON-MICROSCOPE, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 29-40
Authors:
CHUNG CW
SRIHARI K
PRIMAVERA A
Citation: Cw. Chung et al., REWORK OF BGA COMPONENTS, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 41-50
Authors:
YOO WS
MARTINVEGA LA
Citation: Ws. Yoo et La. Martinvega, A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 51-61
Authors:
RAMSEY BJ
EVANS PSA
HARRISON D
Citation: Bj. Ramsey et al., A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 63-67
Authors:
WILLIAMS DJ
PALMER PJ
EDWARDS TC
Citation: Dj. Williams et al., TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY, JOURNAL OF ELECTRONICS MANUFACTURING, 7(1), 1997, pp. 69-77
Authors:
TSO CP
MAHULIKAR SP
Citation: Cp. Tso et Sp. Mahulikar, A SIMULATION OF EVAPORATING MENISCUS-DRIVEN FLOW FOR APPLICATION TO ELECTRONICS COOLING DESIGN, JOURNAL OF ELECTRONICS MANUFACTURING, 6(4), 1996, pp. 231-241
Authors:
CHOON TK
Citation: Tk. Choon, A STUDY OF SOLDERABILITY AND SOLDER SPREADING FOR SMT OPEN JOINTS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(4), 1996, pp. 243-260
Authors:
EKERE NN
HE D
Citation: Nn. Ekere et D. He, PERFORMANCE OF VIBRATING SQUEEGEE IN THE STENCIL PRINTING OF SOLDER PASTES, JOURNAL OF ELECTRONICS MANUFACTURING, 6(4), 1996, pp. 261-270
Authors:
MOYER LK
GUPTA SM
Citation: Lk. Moyer et Sm. Gupta, SIMULTANEOUS COMPONENT SEQUENCING AND FEEDER ASSIGNMENT FOR HIGH-SPEED CHIP SHOOTER MACHINES, JOURNAL OF ELECTRONICS MANUFACTURING, 6(4), 1996, pp. 271-305
Authors:
HASLEHURST L
EKERE NN
Citation: L. Haslehurst et Nn. Ekere, PARAMETER INTERACTIONS IN STENCIL PRINTING OF SOLDER PASTE, JOURNAL OF ELECTRONICS MANUFACTURING, 6(4), 1996, pp. 307-316
Authors:
TEO KC
Citation: Kc. Teo, STENCIL OPTIMIZATION VIA FLOW-CONTROL, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 137-153
Authors:
LAW HW
HUI IK
POON KK
Citation: Hw. Law et al., AUTOMATIC PROCESS PLANNING SYSTEM FOR THE MANUFACTURE OF UNPOPULATED PRINTED-CIRCUIT BOARDS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 155-161
Authors:
DESOUZA RB
AB K
LEE SG
LYE SW
Citation: Rb. Desouza et al., AN INTEGRATED DECISION-SUPPORT ENVIRONMENT FOR DFX AUDIT, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 163-171
Authors:
MOYER LK
GUPTA SM
Citation: Lk. Moyer et Sm. Gupta, SMT FEEDER SLOT ASSIGNMENT FOR PREDETERMINED COMPONENT PLACEMENT PATHS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 173-192
Authors:
XU GP
TSO CP
TOU KW
Citation: Gp. Xu et al., A REVIEW ON COOLING BY CHANNEL FLOW BOILING FOR ELECTRONIC SYSTEMS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 193-207
Authors:
BAUER A
KOLBE W
KOLBEL J
PETERS RP
Citation: A. Bauer et al., MICRO-APPLICATION OF NON-FILLED ADHESIVES FOR PRECISION ASSEMBLY IN MICROSYSTEMS MANUFACTURING, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 209-217
Authors:
MORRIS JE
FENG XF
LEE CL
OAKLEY E
YOUSSOF S
Citation: Je. Morris et al., THE ELECTRICAL AND MECHANICAL-PROPERTIES OF ELECTRICALLY CONDUCTIVE ADHESIVES IN PIN-THROUGH-HOLE APPLICATIONS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(3), 1996, pp. 219-230
Authors:
YEO CK
MHAISALKAR S
PANG HLJ
YEO A
Citation: Ck. Yeo et al., EXPERIMENTAL-STUDY OF SOLDER JOINT RELIABILITY IN A 1256 PIN, 0.4 MM PITCH PQFP, JOURNAL OF ELECTRONICS MANUFACTURING, 6(2), 1996, pp. 67-78
Authors:
MARWAH M
LI Y
MAHAJAN RL
Citation: M. Marwah et al., INTEGRATED NEURAL-NETWORK MODELING FOR ELECTRONIC MANUFACTURING, JOURNAL OF ELECTRONICS MANUFACTURING, 6(2), 1996, pp. 79-91
Authors:
CHOON TK
WILLIAMS DJ
Citation: Tk. Choon et Dj. Williams, INSUFFICIENT SOLDER AND SOLDER BRIDGES - AN EXPERIMENTAL-STUDY OF THEINTERRELATIONS BETWEEN ASSEMBLY PROCESS FAULTS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(2), 1996, pp. 93-99
Authors:
KUAH TH
YEUNG PH
VATH CJ
SRIKANTH N
Citation: Th. Kuah et al., FLOW MODELING OF PQFP DURING TRANSFER MOLDING, JOURNAL OF ELECTRONICS MANUFACTURING, 6(2), 1996, pp. 101-113
Authors:
XU GP
TSO CP
TOU KW
Citation: Gp. Xu et al., A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS, JOURNAL OF ELECTRONICS MANUFACTURING, 6(2), 1996, pp. 115-125
Authors:
YANG LY
LEONG KC
Citation: Ly. Yang et Kc. Leong, THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE, JOURNAL OF ELECTRONICS MANUFACTURING, 6(2), 1996, pp. 127-136