ACNP - Italian Periodicals Catalogue

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Results: 1-10 |

Results: 10

FET AND HEMT THERMAL IMPEDANCES

Authors: ANHOLT R

Citation: R. Anholt, FET AND HEMT THERMAL IMPEDANCES, Solid-state electronics, 42(5), 1998, pp. 849-855

HBT THERMAL ELEMENT DESIGN USING AN ELECTRO THERMAL SIMULATOR/

Authors: ANHOLT R

Citation: R. Anholt, HBT THERMAL ELEMENT DESIGN USING AN ELECTRO THERMAL SIMULATOR/, Solid-state electronics, 42(5), 1998, pp. 857-864

THERMAL IMPEDANCES OF MULTI-FINGER HETEROJUNCTION BIPOLAR-TRANSISTORS

Authors: ANHOLT R

Citation: R. Anholt, THERMAL IMPEDANCES OF MULTI-FINGER HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 42(5), 1998, pp. 865-869

EMITTER UTILIZATION IN HETEROJUNCTION BIPOLAR-TRANSISTORS

Authors: QUACH T JENKINS T BARRETTE J BOZADA C CERNY C DESALVO G DETTMER R EBEL J GILLESPIE J HAVASY C ITO C NAKANO K PETTIFORD C SEWELL J VIA D ANHOLT R

Citation: T. Quach et al., EMITTER UTILIZATION IN HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 41(9), 1997, pp. 1303-1308

PHYSICAL COMPACT COLLECTOR-EMITTER BREAKDOWN MODEL FOR HETEROJUNCTIONBIPOLAR-TRANSISTORS

Authors: ANHOLT R

Citation: R. Anholt, PHYSICAL COMPACT COLLECTOR-EMITTER BREAKDOWN MODEL FOR HETEROJUNCTIONBIPOLAR-TRANSISTORS, Solid-state electronics, 41(11), 1997, pp. 1735-1737

BASE AND COLLECTOR RESISTANCES IN HETEROJUNCTION BIPOLAR-TRANSISTORS

Authors: ANHOLT R BOZADA C DESALVO G DETTMER R EBEL J GILLESPIE J JENKINS T HAVASY C ITO C NAKANO K PETTIFORD C QUACH T SEWELL J VIA D

Citation: R. Anholt et al., BASE AND COLLECTOR RESISTANCES IN HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 41(11), 1997, pp. 1739-1743

THERMAL MANAGEMENT OF MICROWAVE-POWER HETEROJUNCTION BIPOLAR-TRANSISTORS

Authors: BOZADA C CERNY C DESALVO G DETTMER R EBEL J GILLESPIE J HAVASY C JENKINS T ITO C NAKANO K PETTIFORD C QUACH T SEWELL J VIA GD ANHOLT R

Citation: C. Bozada et al., THERMAL MANAGEMENT OF MICROWAVE-POWER HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 41(10), 1997, pp. 1667-1673

COMPARISON OF THERMAL-SHUNT AND FLIP-CHIP HBT THERMAL IMPEDANCES - COMMENT ON NOVEL HBT WITH REDUCED THERMAL IMPEDANCE

Authors: JENKINS T BOZADA C DETTMER R SEWELL J VIA D BARRETTE J EBEL J DESALVO G HAVASY C LIOU L QUACH T GILLESPIE J PETTIFORD C ITO C NAKANO K ANHOLT R

Citation: T. Jenkins et al., COMPARISON OF THERMAL-SHUNT AND FLIP-CHIP HBT THERMAL IMPEDANCES - COMMENT ON NOVEL HBT WITH REDUCED THERMAL IMPEDANCE, IEEE microwave and guided wave letters, 6(7), 1996, pp. 268-269

MEASURING, MODELING, AND MINIMIZING CAPACITANCES IN HETEROJUNCTION BIPOLAR-TRANSISTORS

Authors: ANHOLT R BOZADA C DETTMER R VIA D JENKINS T BARRETTE J EBEL J HAVASY C SEWELL J QUACH T

Citation: R. Anholt et al., MEASURING, MODELING, AND MINIMIZING CAPACITANCES IN HETEROJUNCTION BIPOLAR-TRANSISTORS, Solid-state electronics, 39(7), 1996, pp. 961-963

CHECK ACCURACY OF TEMPERATURE-DEPENDENT EQUIVALENT-CIRCUITS

Authors: ANHOLT R PENCE J

Citation: R. Anholt et J. Pence, CHECK ACCURACY OF TEMPERATURE-DEPENDENT EQUIVALENT-CIRCUITS, Microwaves & RF, 32(9), 1993, pp. 91

Risultati: 1-10 |