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Results:
1-10
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Results: 10
Authors:
BUSNAINA AA
ELSAWY TM
Citation: Aa. Busnaina et Tm. Elsawy, POST-CMP CLEANING USING ACOUSTIC STREAMING, Journal of electronic materials, 27(10), 1998, pp. 1095-1098
Authors:
GALE GW
BUSNAINA AA
ZAAZHOA MR
Citation: Gw. Gale et al., A VISUALIZATION TECHNIQUE FOR SURFACE FLOWS, Chemical engineering communications, 165, 1998, pp. 167-176
Authors:
BUSNAINA AA
DAI F
Citation: Aa. Busnaina et F. Dai, THE REMOVAL OF SUBMICRON PARTICLES IN LIQUID-BASED CLEANING, The Journal of adhesion, 67(1-4), 1998, pp. 181-193
Authors:
CHOPRA D
SUNI II
BUSNAINA AA
Citation: D. Chopra et al., CU DISSOLUTION FROM SI(111) INTO AN SC-1 PROCESS SOLUTION, Journal of the Electrochemical Society, 145(4), 1998, pp. 60-61
Authors:
BUSNAINA AA
GALE GW
Citation: Aa. Busnaina et Gw. Gale, REMOVAL OF SILICA PARTICLES FROM SILICON SUBSTRATES USING MEGASONIC CLEANING, Particulate science and technology, 15(3-4), 1997, pp. 361-369
Authors:
GALE GW
BUSNAINA AA
Citation: Gw. Gale et Aa. Busnaina, REMOVAL OF PARTICULATE CONTAMINANTS USING ULTRASONICS AND MEGASONICS - A REVIEW, Particulate science and technology, 13(3-4), 1995, pp. 197-211
Authors:
RIMAI DS
BUSNAINA AA
Citation: Ds. Rimai et Aa. Busnaina, THE ADHESION AND REMOVAL OF PARTICLES FROM SURFACES, Particulate science and technology, 13(3-4), 1995, pp. 249-270
Authors:
BUSNAINA AA
Citation: Aa. Busnaina, PARTICLE-SUBSTRATE COLLISIONS, PARTICLE REBOUND AND REMOVAL, The Journal of adhesion, 51(1-4), 1995, pp. 167-180
Authors:
BUSNAINA AA
KASHKOUSH II
GALE GW
Citation: Aa. Busnaina et al., AN EXPERIMENTAL-STUDY OF MEGASONIC CLEANING OF SILICON-WAFERS, Journal of the Electrochemical Society, 142(8), 1995, pp. 2812-2817
Authors:
KRISHNAN S
BUSNAINA AA
RIMAI DS
DEMEJO LP
Citation: S. Krishnan et al., THE ADHESION-INDUCED DEFORMATION AND THE REMOVAL OF SUBMICROMETER PARTICLES, Journal of adhesion science and technology, 8(11), 1994, pp. 1357-1370
Risultati:
1-10
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