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Results: 1-25 | 26-26
Results: 1-25/26
REDUCED-ORDER MODELING OF ELECTROMAGNETIC-FIELD INTERACTIONS IN UNBOUNDED-DOMAINS TRUNCATED BY PERFECTLY MATCHED LAYERS
Authors: ZHAO L CANGELLARIS AC
Citation: L. Zhao et Ac. Cangellaris, REDUCED-ORDER MODELING OF ELECTROMAGNETIC-FIELD INTERACTIONS IN UNBOUNDED-DOMAINS TRUNCATED BY PERFECTLY MATCHED LAYERS, Microwave and optical technology letters, 17(1), 1998, pp. 62-66
ELECTRICAL MODELING AND SIMULATION CHALLENGES IN CHIP-PACKAGE CODESIGN
Authors: CANGELLARIS AC
Citation: Ac. Cangellaris, ELECTRICAL MODELING AND SIMULATION CHALLENGES IN CHIP-PACKAGE CODESIGN, IEEE MICRO, 18(4), 1998, pp. 50-59
A REFLECTIONLESS SPONGE LAYER ABSORBING BOUNDARY-CONDITION FOR THE SOLUTION OF MAXWELLS EQUATIONS WITH HIGH-ORDER STAGGERED FINITE-DIFFERENCE SCHEMES
Authors: PETROPOULOS PG ZHAO L CANGELLARIS AC
Citation: Pg. Petropoulos et al., A REFLECTIONLESS SPONGE LAYER ABSORBING BOUNDARY-CONDITION FOR THE SOLUTION OF MAXWELLS EQUATIONS WITH HIGH-ORDER STAGGERED FINITE-DIFFERENCE SCHEMES, Journal of computational physics, 139(1), 1998, pp. 184-208
SIMULATION OF MULTICONDUCTOR TRANSMISSION-LINES USING KRYLOV SUBSPACEORDER-REDUCTION TECHNIQUES
Authors: CELIK M CANGELLARIS AC
Citation: M. Celik et Ac. Cangellaris, SIMULATION OF MULTICONDUCTOR TRANSMISSION-LINES USING KRYLOV SUBSPACEORDER-REDUCTION TECHNIQUES, IEEE transactions on computer-aided design of integrated circuits and systems, 16(5), 1997, pp. 485-496
AN ALL-PURPOSE TRANSMISSION-LINE MODEL FOR INTERCONNECT SIMULATION INSPICE
Authors: CELIK M CANGELLARIS AC YAGHMOUR A
Citation: M. Celik et al., AN ALL-PURPOSE TRANSMISSION-LINE MODEL FOR INTERCONNECT SIMULATION INSPICE, IEEE transactions on microwave theory and techniques, 45(10), 1997, pp. 1857-1867
HYBRID ELECTROMAGNETIC MODELING OF NOISE INTERACTIONS IN PACKAGED ELECTRONICS BASED ON THE PARTIAL-ELEMENT EQUIVALENT-CIRCUIT FORMULATION
Authors: PINELLO W CANGELLARIS AC RUEHLI A
Citation: W. Pinello et al., HYBRID ELECTROMAGNETIC MODELING OF NOISE INTERACTIONS IN PACKAGED ELECTRONICS BASED ON THE PARTIAL-ELEMENT EQUIVALENT-CIRCUIT FORMULATION, IEEE transactions on microwave theory and techniques, 45(10), 1997, pp. 1889-1896
EFFICIENT TRANSIENT SIMULATION OF LOSSY PACKAGING INTERCONNECTS USINGMOMENT-MATCHING TECHNIQUES (VOL 19, PG 70, 1996)
Authors: CELIK M CANGELLARIS AC
Citation: M. Celik et Ac. Cangellaris, EFFICIENT TRANSIENT SIMULATION OF LOSSY PACKAGING INTERCONNECTS USINGMOMENT-MATCHING TECHNIQUES (VOL 19, PG 70, 1996), IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 692-692
A NOVEL METHOD OF MEASURING MICROELECTRONIC INTERCONNECT TRANSMISSION-LINE PARAMETERS AND DISCONTINUITY EQUIVALENT ELECTRICAL PARAMETERS USING MULTIPLE REFLECTIONS
Authors: ABERNETHY CE CANGELLARIS AC PRINCE JL
Citation: Ce. Abernethy et al., A NOVEL METHOD OF MEASURING MICROELECTRONIC INTERCONNECT TRANSMISSION-LINE PARAMETERS AND DISCONTINUITY EQUIVALENT ELECTRICAL PARAMETERS USING MULTIPLE REFLECTIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 32-39
EFFICIENT TRANSIENT SIMULATION OF LOSSY PACKAGING INTERCONNECTS USINGMOMENT-MATCHING TECHNIQUES
Authors: CELIK M CANGELLARIS AC
Citation: M. Celik et Ac. Cangellaris, EFFICIENT TRANSIENT SIMULATION OF LOSSY PACKAGING INTERCONNECTS USINGMOMENT-MATCHING TECHNIQUES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 64-73
EXPERIMENTAL CHARACTERIZATION OF TRANSMISSION-LINES IN THIN-FILM MULTICHIP MODULES
Authors: LIPA S STEER MB CANGELLARIS AC FRANZON PD
Citation: S. Lipa et al., EXPERIMENTAL CHARACTERIZATION OF TRANSMISSION-LINES IN THIN-FILM MULTICHIP MODULES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 122-126
A GENERAL-APPROACH FOR THE DEVELOPMENT OF UNSPLIT-FIELD TIME-DOMAIN IMPLEMENTATIONS OF PERFECTLY MATCHED LAYERS FOR FDTD GRID TRUNCATION
Authors: ZHAO L CANGELLARIS AC
Citation: L. Zhao et Ac. Cangellaris, A GENERAL-APPROACH FOR THE DEVELOPMENT OF UNSPLIT-FIELD TIME-DOMAIN IMPLEMENTATIONS OF PERFECTLY MATCHED LAYERS FOR FDTD GRID TRUNCATION, IEEE microwave and guided wave letters, 6(5), 1996, pp. 209-211
APPLICATION OF THE PML ABSORBING BOUNDARY-CONDITION TO THE ANALYSIS OF PATCH ANTENNAS
Authors: PASIK MF AGUIRRE G CANGELLARIS AC
Citation: Mf. Pasik et al., APPLICATION OF THE PML ABSORBING BOUNDARY-CONDITION TO THE ANALYSIS OF PATCH ANTENNAS, Electromagnetics, 16(4), 1996, pp. 435-449
SIMULATION OF DISPERSIVE MULTICONDUCTOR TRANSMISSION-LINES BY PADE-APPROXIMATION VIA THE LANCZOS PROCESS
Authors: CELIK M CANGELLARIS AC
Citation: M. Celik et Ac. Cangellaris, SIMULATION OF DISPERSIVE MULTICONDUCTOR TRANSMISSION-LINES BY PADE-APPROXIMATION VIA THE LANCZOS PROCESS, IEEE transactions on microwave theory and techniques, 44(12), 1996, pp. 2525-2535
GT-PML - GENERALIZED THEORY OF PERFECTLY MATCHED LAYERS AND ITS APPLICATION TO THE REFLECTIONLESS TRUNCATION OF FINITE-DIFFERENCE TIME-DOMAIN GRIDS
Authors: ZHAO L CANGELLARIS AC
Citation: L. Zhao et Ac. Cangellaris, GT-PML - GENERALIZED THEORY OF PERFECTLY MATCHED LAYERS AND ITS APPLICATION TO THE REFLECTIONLESS TRUNCATION OF FINITE-DIFFERENCE TIME-DOMAIN GRIDS, IEEE transactions on microwave theory and techniques, 44(12), 1996, pp. 2555-2563
SIMULTANEOUS SWITCHING NOISE - INFLUENCE OF PLANE-PLANE AND PLANE-SIGNAL TRACE COUPLING
Authors: VAIDYANATH A THORODDSEN B PRINCE JL CANGELLARIS AC
Citation: A. Vaidyanath et al., SIMULTANEOUS SWITCHING NOISE - INFLUENCE OF PLANE-PLANE AND PLANE-SIGNAL TRACE COUPLING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 496-502
PARALLEL IMPLEMENTATION OF DOMAIN DECOMPOSITION METHODS FOR THE ELECTROMAGNETIC ANALYSIS OF GUIDED-WAVE SYSTEMS
Authors: SPRING CT CANGELLARIS AC
Citation: Ct. Spring et Ac. Cangellaris, PARALLEL IMPLEMENTATION OF DOMAIN DECOMPOSITION METHODS FOR THE ELECTROMAGNETIC ANALYSIS OF GUIDED-WAVE SYSTEMS, Journal of electromagnetic waves and applications, 9(1-2), 1995, pp. 175-192
A STRETCHED COORDINATE TECHNIQUE FOR NUMERICAL ABSORPTION OF EVANESCENT AND PROPAGATING WAVES IN PLANAR WAVE-GUIDING STRUCTURES
Authors: GRIBBONS MA PINELLO WP CANGELLARIS AC
Citation: Ma. Gribbons et al., A STRETCHED COORDINATE TECHNIQUE FOR NUMERICAL ABSORPTION OF EVANESCENT AND PROPAGATING WAVES IN PLANAR WAVE-GUIDING STRUCTURES, IEEE transactions on microwave theory and techniques, 43(12), 1995, pp. 2883-2889
SCATTERING PARAMETER-BASED SIMULATION OF TRANSIENTS IN LOSSY NONLINEARLY TERMINATED PACKAGING INTERCONNECTIONS
Authors: VAKANAS LP CANGELLARIS AC PALUSINSKI OA
Citation: Lp. Vakanas et al., SCATTERING PARAMETER-BASED SIMULATION OF TRANSIENTS IN LOSSY NONLINEARLY TERMINATED PACKAGING INTERCONNECTIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 472-479
FINITE-ELEMENT GRID TRUNCATION SCHEMES BASED ON THE MEASURED EQUATIONOF INVARIANCE
Authors: WRIGHT DB CANGELLARIS AC
Citation: Db. Wright et Ac. Cangellaris, FINITE-ELEMENT GRID TRUNCATION SCHEMES BASED ON THE MEASURED EQUATIONOF INVARIANCE, Radio science, 29(4), 1994, pp. 907-921
REFERENCE PLANE PARASITICS MODELING AND THEIR CONTRIBUTION TO THE POWER AND GROUND PATH EFFECTIVE INDUCTANCE AS SEEN BY THE OUTPUT DRIVERS
Authors: SENTHINATHAN R CANGELLARIS AC PRINCE JL
Citation: R. Senthinathan et al., REFERENCE PLANE PARASITICS MODELING AND THEIR CONTRIBUTION TO THE POWER AND GROUND PATH EFFECTIVE INDUCTANCE AS SEEN BY THE OUTPUT DRIVERS, IEEE transactions on microwave theory and techniques, 42(9), 1994, pp. 1765-1773
FINITE-ELEMENT MODELING OF ELECTROMAGNETIC-WAVE INTERACTIONS WITH PERIODIC DIELECTRIC STRUCTURES
Authors: PINELLO WP LEE R CANGELLARIS AC
Citation: Wp. Pinello et al., FINITE-ELEMENT MODELING OF ELECTROMAGNETIC-WAVE INTERACTIONS WITH PERIODIC DIELECTRIC STRUCTURES, IEEE transactions on microwave theory and techniques, 42(12), 1994, pp. 2294-2301
RIGOROUS ELECTROMAGNETIC MODELING OF CHIP-TO-PACKAGE (1ST-LEVEL) INTERCONNECTIONS
Authors: TSUEI YS CANGELLARIS AC PRINCE JL
Citation: Ys. Tsuei et al., RIGOROUS ELECTROMAGNETIC MODELING OF CHIP-TO-PACKAGE (1ST-LEVEL) INTERCONNECTIONS, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 876-883
MODELING AND SIMULATION OF COUPLED TRANSMISSION-LINE INTERCONNECTS OVER A NOISY REFERENCE PLANE
Authors: SENTHINATHAN R NIMMAGADDA S PRINCE JL CANGELLARIS AC
Citation: R. Senthinathan et al., MODELING AND SIMULATION OF COUPLED TRANSMISSION-LINE INTERCONNECTS OVER A NOISY REFERENCE PLANE, IEEE transactions on components, hybrids, and manufacturing technology, 16(7), 1993, pp. 705-713
MODULE FREQUENCY ESTIMATION AND NOISE BUDGET LIMITATIONS - TRADE-OFFSIN MULTICHIP MODULES AS A FUNCTION OF CMOS CHIPS INTEGRATION
Authors: SENTHINATHAN R PRINCE JL CANGELLARIS AC
Citation: R. Senthinathan et al., MODULE FREQUENCY ESTIMATION AND NOISE BUDGET LIMITATIONS - TRADE-OFFSIN MULTICHIP MODULES AS A FUNCTION OF CMOS CHIPS INTEGRATION, IEEE transactions on components, hybrids, and manufacturing technology, 16(5), 1993, pp. 478-483
FINITE-DIFFERENCE TIME-DOMAIN ANALYSIS OF PULSE-PROPAGATION IN MULTICHIP-MODULE INTERCONNECTS
Authors: GRIBBONS M CANGELLARIS AC PRINCE JL
Citation: M. Gribbons et al., FINITE-DIFFERENCE TIME-DOMAIN ANALYSIS OF PULSE-PROPAGATION IN MULTICHIP-MODULE INTERCONNECTS, IEEE transactions on components, hybrids, and manufacturing technology, 16(5), 1993, pp. 490-498
Risultati: 1-25 | 26-26