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Results:
1-8
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Results: 8
Authors:
Yun, CS
Malberti, P
Ciappa, M
Fichtner, W
Citation: Cs. Yun et al., Thermal component model for electrothermal analysis of IGBT module systems, IEEE T AD P, 24(3), 2001, pp. 401-406
Authors:
Ciampolini, L
Giannazzo, F
Ciappa, M
Fichtner, W
Raineri, V
Citation: L. Ciampolini et al., Simulation of scanning capacitance microscopy measurements on micro-sectioned and bevelled n(+)-p samples, MAT SC S PR, 4(1-3), 2001, pp. 85-88
Authors:
Yabuhara, H
Ciappa, M
Fichtner, W
Citation: H. Yabuhara et al., Diamond-coated cantilevers for scanning capacitance microscopy applications, MICROEL REL, 41(9-10), 2001, pp. 1459-1463
Authors:
Giannazzo, F
Calcagno, L
Raineri, V
Ciampolini, L
Ciappa, M
Napolitani, E
Citation: F. Giannazzo et al., Quantitative carrier profiling in ion-implanted 6H-SiC, APPL PHYS L, 79(8), 2001, pp. 1211-1213
Authors:
Malberti, P
Ciampolini, L
Ciappa, M
Fichtner, W
Citation: P. Malberti et al., Quantification of scanning capacitance microscopy measurements for 2D dopant profiling, MICROEL REL, 40(8-10), 2000, pp. 1395-1399
Authors:
Meneghesso, G
Ciappa, M
Malberti, P
Sponton, L
Croce, G
Contiero, C
Zanoni, E
Citation: G. Meneghesso et al., Overstress and electrostatic discharge in CMOS and BCD integrated circuits, MICROEL REL, 40(8-10), 2000, pp. 1739-1746
Authors:
Ciappa, M
Malberti, P
Fichtner, W
Cova, P
Cattani, L
Fantini, F
Citation: M. Ciappa et al., Lifetime extrapolation for IGBT modules under realistic operation conditions, MICROEL REL, 39(6-7), 1999, pp. 1131-1136
Authors:
Ciampolini, L
Ciappa, M
Malberti, P
Regli, P
Fichtner, W
Citation: L. Ciampolini et al., Modelling thermal effects of large contiguous voids in solder joints, MICROELEC J, 30(11), 1999, pp. 1115-1123
Risultati:
1-8
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