Citation: P. Egger et al., ESD MONITOR CIRCUIT - A TOOL TO INVESTIGATE THE SUSCEPTIBILITY AND FAILURE MECHANISMS OF THE CHARGED DEVICE MODEL, Quality and reliability engineering international, 12(4), 1996, pp. 265-270
Citation: H. Wolf et al., PULSED THERMAL CHARACTERIZATION OF A REVERSE-BIASED PN-JUNCTION FOR ESD HBM SIMULATION, Microelectronics and reliability, 36(11-12), 1996, pp. 1711-1714
Authors:
MUSSHOFF C
WOLF H
GIESER H
EGGER P
GUGGENMOS X
Citation: C. Musshoff et al., RISETIME EFFECTS OF HBM AND SQUARE PULSES ON THE FAILURE THRESHOLDS OF GGNMOS-TRANSISTORS, Microelectronics and reliability, 36(11-12), 1996, pp. 1743-1746
Authors:
VERHAEGE K
GROESENEKEN GV
MAES HE
EGGER P
GIESER H
Citation: K. Verhaege et al., INFLUENCE OF TESTER, TEST METHOD, AND DEVICE TYPE ON CDM ESD TESTING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(2), 1995, pp. 284-294
Citation: C. Russ et al., ESD PROTECTION ELEMENTS DURING HBM STRESS TESTS - FURTHER NUMERICAL AND EXPERIMENTAL RESULTS, Quality and reliability engineering international, 11(4), 1995, pp. 285-294