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Results:
1-18
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Results: 18
Authors:
KITTL JA
HONG QZ
RODDER M
BREEDIJK T
Citation: Ja. Kittl et al., NOVEL SELF-ALIGNED TI SILICIDE PROCESS FOR SCALED CMOS TECHNOLOGIES WITH LOW SHEET RESISTANCE AT 0.06-MU-M GATE LENGTHS, IEEE electron device letters, 19(5), 1998, pp. 151-153
Authors:
KITTL JA
HONG QZ
YANG H
YU N
SAMAVEDAM SB
GRIBELYUK MA
Citation: Ja. Kittl et al., ADVANCED SALICIDES FOR 0.10 MU-M CMOS - CO SALICIDE PROCESSES WITH LOW DIODE LEAKAGE AND TI SALICIDE PROCESSES WITH DIRECT FORMATION OF LOW-RESISTIVITY C54 TISI2, Thin solid films, 332(1-2), 1998, pp. 404-411
Authors:
LU JP
HSU WY
HONG QZ
DIXIT GA
LUTTMER JD
HAVEMANN RH
CHEN PJ
TSAI HL
MAGEL LK
Citation: Jp. Lu et al., THERMAL-STABILITY OF AL BARRIER/TISIX MULTILAYER STRUCTURES/, Thin solid films, 320(1), 1998, pp. 20-25
Authors:
KITTL JA
HONG QZ
Citation: Ja. Kittl et Qz. Hong, SELF-ALIGNED TI AND CO SILICIDES FOR HIGH-PERFORMANCE SUB-0.18 MU-M CMOS TECHNOLOGIES, Thin solid films, 320(1), 1998, pp. 110-121
Authors:
CLEVENGER LA
ARCOT B
ZIEGLER W
COLGAN EG
HONG QZ
DHEURLE FM
CABRAL C
GALLO TA
HARPER JME
Citation: La. Clevenger et al., INTERDIFFUSION AND PHASE-FORMATION IN CU(SN) ALLOY-FILMS, Journal of applied physics, 83(1), 1998, pp. 90-99
Authors:
HSU WY
HONG QZ
LIU HY
DOUGLAS M
TAYLOR K
MAGEL LK
LUTTMER JD
HAVEMANN RH
Citation: Wy. Hsu et al., EFFECT OF AR SPUTTER ETCH ON THE TEXTURE OF TI AND AL TIN/TI METAL STACK/, Journal of the Electrochemical Society, 144(9), 1997, pp. 248-250
Authors:
COLGAN EG
GAMBINO JP
HONG QZ
Citation: Eg. Colgan et al., FORMATION AND STABILITY OF SILICIDES ON POLYCRYSTALLINE SILICON, Materials science & engineering. R, Reports, 16(2), 1996, pp. 43-96
Authors:
KITTL JA
HONG QZ
Citation: Ja. Kittl et Qz. Hong, MATERIALS ASPECTS OF TI AND CO SILICIDATION OF NARROW POLYSILICON LINES, Thin solid films, 291, 1996, pp. 473-476
Authors:
LU JP
HSU WY
HONG QZ
DIXIT GA
LUTTMER JD
HAVEMANN RH
MAGEL LK
Citation: Jp. Lu et al., A NOVEL PROCESS FOR FABRICATING CONFORMAL AND STABLE TIN-BASED BARRIER, Journal of the Electrochemical Society, 143(12), 1996, pp. 279-280
REDUCTION IN FLUX DIVERGENCE AT VIAS FOR IMPROVED ELECTROMIGRATION INMULTILAYERED ALCU INTERCONNECTS
Authors:
TING L
HONG QZ
HSU WY
Citation: L. Ting et al., REDUCTION IN FLUX DIVERGENCE AT VIAS FOR IMPROVED ELECTROMIGRATION INMULTILAYERED ALCU INTERCONNECTS, Applied physics letters, 69(14), 1996, pp. 2134-2136
Authors:
HONG QZ
JENG SP
HAVEMANN RH
TSAI HL
LIU HY
Citation: Qz. Hong et al., TEXTURE-INDUCED ASYMMETRIC REACTIONS IN TIN A1-CU/TIN/, Journal of applied physics, 78(12), 1995, pp. 7419-7421
Authors:
HONG QZ
HONG SQ
DHEURLE FM
HARPER JME
Citation: Qz. Hong et al., THERMAL-STABILITY OF SILICIDE ON POLYCRYSTALLINE SI, Thin solid films, 253(1-2), 1994, pp. 479-484
Authors:
ARCOT B
MURARKA SP
CLEVENGER LA
HONG QZ
ZIEGLER W
HARPER JME
Citation: B. Arcot et al., INTERMETALLIC FORMATION IN COPPER MAGNESIUM THIN-FILMS - KINETICS, NUCLEATION AND GROWTH, AND EFFECT OF INTERFACIAL OXYGEN/, Journal of applied physics, 76(9), 1994, pp. 5161-5170
Authors:
HONG SQ
HONG QZ
LI J
MAYER JW
Citation: Sq. Hong et al., INTERDIFFUSION AND REACTION IN CU PTSI/SI(100) SYSTEMS/, Journal of applied physics, 75(8), 1994, pp. 3959-3963
Authors:
HONG QZ
BARMAK K
HONG SQ
CLEVENGER LA
Citation: Qz. Hong et al., CRYSTALLIZATION OF COEVAPORATED AND ION-IRRADIATED AMORPHOUS COSI2, Journal of applied physics, 74(8), 1993, pp. 4958-4962
Authors:
HONG SQ
HONG QZ
MAYER JW
Citation: Sq. Hong et al., EFFECTS OF GROWN-IN STRESS ON THE METASTABLE SOLID SOLUBILITY LIMITS IN SB IMPLANTED GE0.1SI0.9 ALLOYS, Applied physics letters, 63(15), 1993, pp. 2053-2055
Authors:
HONG QZ
BARMAK K
DHEURLE FM
Citation: Qz. Hong et al., FORMATION OF A C49 TIGE2 PHASE DURING ANNEALING A COEVAPORATED TI0.33GE0.67 ALLOY, Applied physics letters, 62(26), 1993, pp. 3435-3437
Authors:
HONG QZ
DHEURLE FM
HARPER JME
HONG SQ
Citation: Qz. Hong et al., STRESSES AND MORPHOLOGICAL INSTABILITIES IN SILICIDE POLYCRYSTALLINE SI LAYERED STRUCTURES, Applied physics letters, 62(21), 1993, pp. 2637-2639
Risultati:
1-18
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