Authors: Gaganidze, E Schwab, R Halbritter, J Heidinger, R Aidam, R Schneider, R

Citation: E. Gaganidze et al., Power handling capabilities of Y-Ba-Cu-O wafers and patterned microstrip resonators, IEEE APPL S, 11(1), 2001, pp. 2808-2811

Authors: Schwab, R Gaganidze, E Halbritter, J Heidinger, R Aidam, R Schneider, R

Citation: R. Schwab et al., YBCO wafer qualification by surface resistance measurements combined with performance studies of microstrip resonators, PHYSICA C, 351(1), 2001, pp. 25-28

Authors: Thumm, M Arnold, A Heidinger, R Rohde, M Schwab, R Spoerl, R

Citation: M. Thumm et al., Status report on CVD-diamond window development for high power ECRH, FUSION ENG, 53, 2001, pp. 517-524

Authors: Brandon, JR Coe, SE Sussmann, RS Sakamoto, K Sporl, R Heidinger, R Hanks, S

Citation: Jr. Brandon et al., Development of CVD diamond r.f. windows for ECRH, FUSION ENG, 53, 2001, pp. 553-559

Authors: Geerk, J Ratzel, F Rietschel, H Linker, G Heidinger, R Schwab, R

Citation: J. Geerk et al., Simultaneous double-sided deposition of HTS films on 3-inch wafers by ICM-sputtering, IEEE APPL S, 9(2), 1999, pp. 1543-1546

Authors: Lorenz, M Hochmuth, H Natusch, D Lippold, G Svetchnikov, VL Kaiser, T Hein, MA Schwab, R Heidinger, R

Citation: M. Lorenz et al., Ag-doped double-sided PLD-YBCO thin films for passive microwave devices infuture communication systems, IEEE APPL S, 9(2), 1999, pp. 1936-1939