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Results: 1-4 |
Results: 4

Authors: Aspar, B Moriceau, H Jalaguier, E Lagahe, C Soubie, A Biasse, B Papon, AM Claverie, A Grisolia, J Benassayag, G Letertre, F Rayssac, O Barge, T Maleville, C Ghyselen, B
Citation: B. Aspar et al., The generic nature of the Smart-Cut((R)) process for thin film transfer, J ELEC MAT, 30(7), 2001, pp. 834-840

Authors: Seassal, C Rojo-Romeo, P Letartre, X Viktorovitch, P Hollinger, G Jalaguier, E Pocas, S Aspar, B
Citation: C. Seassal et al., InP microdisk lasers on silicon wafer: CW room temperature operation at 1.6 mu m, ELECTR LETT, 37(4), 2001, pp. 222-223

Authors: Monat, C Seassal, C Letartre, X Viktorovitch, P Regreny, P Gendry, M Rojo-Romeo, P Hollinger, G Jalaguier, E Pocas, S Aspar, B
Citation: C. Monat et al., InP 2D photonic crystal microlasers on silicon wafer: room temperature operation at 1.55 mu m, ELECTR LETT, 37(12), 2001, pp. 764-766

Authors: Aspar, B Jalaguier, E Mas, A Locatelli, C Rayssac, O Moriceau, H Pocas, S Papon, AM Michaud, JF Bruel, M
Citation: B. Aspar et al., Smart-Cut (R) process using metallic bonding: Application to transfer of Si, GaAs, InP thin films, ELECTR LETT, 35(12), 1999, pp. 1024-1025
Risultati: 1-4 |