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Results: 1-12 |
Results: 12
CMOS COMPATIBLE TEMPERATURE SENSOR-BASED ON THE LATERAL BIPOLAR-TRANSISTOR FOR VERY WIDE TEMPERATURE-RANGE APPLICATIONS
Authors: BIANCHI RA DOSSANTOS FV KARAM JM COURTOIS B PRESSECQ F SIFFLET S
Citation: Ra. Bianchi et al., CMOS COMPATIBLE TEMPERATURE SENSOR-BASED ON THE LATERAL BIPOLAR-TRANSISTOR FOR VERY WIDE TEMPERATURE-RANGE APPLICATIONS, Sensors and actuators. A, Physical, 71(1-2), 1998, pp. 3-9
THERMAL MONITORING OF SELF-CHECKING SYSTEMS
Authors: SZEKELY V RENCZ M KARAM JM LUBASZEWSKI M COURTOIS B
Citation: V. Szekely et al., THERMAL MONITORING OF SELF-CHECKING SYSTEMS, JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 12(1-2), 1998, pp. 81-92
CAD TOOLS AND FOUNDRIES TO BOOST MICROSYSTEMS DEVELOPMENT
Authors: COURTOIS B KARAM JM LUBASZEWSKI M SZEKELY V RENCZ M HOFMANN K GLESNER M
Citation: B. Courtois et al., CAD TOOLS AND FOUNDRIES TO BOOST MICROSYSTEMS DEVELOPMENT, Materials science & engineering. B, Solid-state materials for advanced technology, 51(1-3), 1998, pp. 242-253
BULK MICROMACHINING CHARACTERIZATION OF 0.2 MU-M HEMT MMIC TECHNOLOGYFOR GAAS MEMS DESIGN
Authors: RIBAS RP LECLERCQ JL KARAM JM COURTOIS B VIKTOROVITCH P
Citation: Rp. Ribas et al., BULK MICROMACHINING CHARACTERIZATION OF 0.2 MU-M HEMT MMIC TECHNOLOGYFOR GAAS MEMS DESIGN, Materials science & engineering. B, Solid-state materials for advanced technology, 51(1-3), 1998, pp. 267-273
MICROMACHINED PLANAR SPIRAL INDUCTOR IN STANDARD GAAS HEMT MMIC TECHNOLOGY
Authors: RIBAS RP LESCOT J LECLERCQ JL BENNOURI N KARAM JM
Citation: Rp. Ribas et al., MICROMACHINED PLANAR SPIRAL INDUCTOR IN STANDARD GAAS HEMT MMIC TECHNOLOGY, IEEE electron device letters, 19(8), 1998, pp. 285-287
LOW-DIMENSIONAL STRUCTURES AND DEVICES - MICROMACHINED DEVICES - INTRODUCTION
Authors: HENINI M KARAM JM
Citation: M. Henini et Jm. Karam, LOW-DIMENSIONAL STRUCTURES AND DEVICES - MICROMACHINED DEVICES - INTRODUCTION, Microelectronics, 29(9), 1998, pp. 577-578
III-V MICROMACHINED DEVICES FOR MICROSYSTEMS
Authors: LECLERCQ JL RIBAS RP KARAM JM VIKTOROVITCH P
Citation: Jl. Leclercq et al., III-V MICROMACHINED DEVICES FOR MICROSYSTEMS, Microelectronics, 29(9), 1998, pp. 613-619
CMOS-COMPATIBLE SMART TEMPERATURE SENSORS
Authors: BIANCHI RA DOSSANTOS FV KARAM JM COURTOIS B PRESSECQ F SIFFLET S
Citation: Ra. Bianchi et al., CMOS-COMPATIBLE SMART TEMPERATURE SENSORS, Microelectronics, 29(9), 1998, pp. 627-636
ELECTRONIC DESIGN AUTOMATION MAINSTREAMS MEMS DESIGN
Authors: KARAM JM
Citation: Jm. Karam, ELECTRONIC DESIGN AUTOMATION MAINSTREAMS MEMS DESIGN, Electronic design, 46(16), 1998, pp. 67
CAD TOOLS FOR BRIDGING MICROSYSTEMS AND FOUNDRIES
Authors: KARAM JM COURTOIS B BOUTAMINE H
Citation: Jm. Karam et al., CAD TOOLS FOR BRIDGING MICROSYSTEMS AND FOUNDRIES, IEEE design & test of computers, 14(2), 1997, pp. 34-39
LOW-DIMENSIONAL STRUCTURES AND DEVICES - MICROTECHNOLOGY AND NANOTECHNOLOGY
Authors: HENINI M KARAM JM
Citation: M. Henini et Jm. Karam, LOW-DIMENSIONAL STRUCTURES AND DEVICES - MICROTECHNOLOGY AND NANOTECHNOLOGY, Microelectronics, 28(4), 1997, pp. 367-370
COLLECTIVE FABRICATION OF MICROSYSTEMS COMPATIBLE WITH CMOS THROUGH THE CMP SERVICE
Authors: KARAM JM COURTOIS B PARET JM
Citation: Jm. Karam et al., COLLECTIVE FABRICATION OF MICROSYSTEMS COMPATIBLE WITH CMOS THROUGH THE CMP SERVICE, Materials science & engineering. B, Solid-state materials for advanced technology, 35(1-3), 1995, pp. 219-223
Risultati: 1-12 |