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Results: 1-9 |
Results: 9
Multi-component high-K gate dielectrics for the silicon industry
Authors: Manchanda, L Morris, MD Green, ML van Dover, RB Klemens, F Sorsch, TW Silverman, PJ Wilk, G Busch, B Aravamudhan, S
Citation: L. Manchanda et al., Multi-component high-K gate dielectrics for the silicon industry, MICROEL ENG, 59(1-4), 2001, pp. 351-359
Implementing advanced lithography technology: A 100 MHz, 1 V digital signal processor fabricated with phase shifted gates
Authors: Watson, GP Kizilyalli, IC Nalamasu, O Cirelli, RA Miller, M Wang, Y Pati, B Radosevich, J Kohler, R Freyman, R Klemens, F Mansfield, W Vaidya, H Timko, A Trimble, L Frackoviak, J
Citation: Gp. Watson et al., Implementing advanced lithography technology: A 100 MHz, 1 V digital signal processor fabricated with phase shifted gates, J VAC SCI B, 18(6), 2000, pp. 2877-2880
Wavelength-independent optical lithography
Authors: Pau, S Nalamasu, O Cirelli, R Frackoviak, J Timko, A Watson, P Klemens, F Timp, G
Citation: S. Pau et al., Wavelength-independent optical lithography, J VAC SCI B, 18(1), 2000, pp. 317-320
A 2 million transistor digital signal processor with 120 nm gates fabricated by 248 nm wavelength phase shift technology
Authors: Watson, GP Kizilyalli, IC Miller, M Wang, YT Pati, B Cirelli, RA Nalamasu, O Radosevich, J Kohler, R Freyman, R Baumann, F Klemens, F Mansfield, W Vaidya, H Frackoviak, J Timko, A Barr, DL Bolan, K
Citation: Gp. Watson et al., A 2 million transistor digital signal processor with 120 nm gates fabricated by 248 nm wavelength phase shift technology, MICROEL ENG, 53(1-4), 2000, pp. 101-104
Sub-wavelength printing using multiple overlapping masks
Authors: Pau, S Nalamasu, O Cirelli, R Frackoviak, J Timko, A Watson, GP Klemens, F Timp, G
Citation: S. Pau et al., Sub-wavelength printing using multiple overlapping masks, MICROEL ENG, 53(1-4), 2000, pp. 119-122
Marks for SCALPEL((R)) tool optics optimization
Authors: Farrow, RC Gallatin, GM Waskiewicz, WK Liddle, JA Kizilyalli, I Kornblit, A Biddick, C Blakey, M Klemens, F Felker, J Kraus, J Mkrtchyan, M Orphanos, PA Layadi, N Merchant, S
Citation: Rc. Farrow et al., Marks for SCALPEL((R)) tool optics optimization, MICROEL ENG, 53(1-4), 2000, pp. 309-312
The relentless march of the MOSFET gate oxide thickness to zero
Authors: Timp, G Bude, J Baumann, F Bourdelle, KK Boone, T Garno, J Ghetti, A Green, M Gossmann, H Kim, Y Kleiman, R Kornblit, A Klemens, F Moccio, S Muller, D Rosamilia, J Silverman, P Sorsch, T Timp, W Tennant, D Tung, R Weir, B
Citation: G. Timp et al., The relentless march of the MOSFET gate oxide thickness to zero, MICROEL REL, 40(4-5), 2000, pp. 557-562
Progress toward a 30 nm silicon metal-oxide-semiconductor gate technology
Authors: Tennant, DM Timp, GL Ocola, LE Green, M Sorsch, T Kornblit, A Klemens, F Kleiman, R Kim, Y Timp, W
Citation: Dm. Tennant et al., Progress toward a 30 nm silicon metal-oxide-semiconductor gate technology, J VAC SCI B, 17(6), 1999, pp. 3158-3163
CMOS compatible alignment marks for the SCALPEL proof of lithography tool
Authors: Farrow, RC Waskiewicz, WK Kizilyalli, I Ocola, L Felker, J Biddick, C Gallatin, G Mkrtchyan, M Blakey, M Kraus, J Novembre, A Orphanos, P Peabody, M Kasica, R Kornblit, A Klemens, F
Citation: Rc. Farrow et al., CMOS compatible alignment marks for the SCALPEL proof of lithography tool, MICROEL ENG, 46(1-4), 1999, pp. 263-266
Risultati: 1-9 |