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Results:
1-10
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Results: 10
Authors:
Lau, JH
Chang, C
Lee, SWR
Citation: Jh. Lau et al., Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies, IEEE T COMP, 24(2), 2001, pp. 285-292
Authors:
Lau, JH
Citation: Jh. Lau, Bending and twisting of cylindrical solder interconnections with creep, SOLDER S MT, 13(2), 2001, pp. 14-20
Authors:
Lau, JH
Lee, SWR
Chang, C
Citation: Jh. Lau et al., Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants, IEEE T COMP, 23(2), 2000, pp. 323-333
Authors:
Lau, JH
Lee, SWR
Citation: Jh. Lau et Swr. Lee, Fracture mechanics analysis of low cost solder bumped flip chip assemblieswith imperfect underfills, J ELEC PACK, 122(4), 2000, pp. 306-310
Authors:
Lau, JH
Lee, SWR
Chang, C
Citation: Jh. Lau et al., Solder joint reliability of wafer level chip scale packages (WLCSP): A time-temperature-dependent creep analysis, J ELEC PACK, 122(4), 2000, pp. 311-316
Authors:
Lau, JH
Lee, SWR
Citation: Jh. Lau et Swr. Lee, Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method, J ELEC PACK, 122(1), 2000, pp. 34-41
Authors:
Lee, SWP
Lau, JH
Citation: Swp. Lee et Jh. Lau, Solder joint reliability of plastic ball grid array with solder bumped flip chip, SOLDER S MT, 12(2), 2000, pp. 16-23
Authors:
Lau, JH
Chang, C
Citation: Jh. Lau et C. Chang, Characterization of underfill materials for functional solder bumped flip chips on board applications, IEEE T COMP, 22(1), 1999, pp. 111-119
Authors:
Lau, JH
Chang, C
Citation: Jh. Lau et C. Chang, TMA, DMA, DSC and TGA of lead free solders, SOLDER S MT, 11(2), 1999, pp. 17-24
Authors:
Lee, SWR
Lau, JH
Citation: Swr. Lee et Jh. Lau, Solder joint reliability of cavity-down plastic ball grid array assemblies, SOLDER S MT, 10(1), 1998, pp. 26
Risultati:
1-10
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